Inventor

Jacob Tyler WRIGHT

Inventor
US

Overview

4→
Patents
2021–2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics15%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering15%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts11%
C09DCoating compositions, e.g. paints, varnishes or lacquers11%
B22FWorking metallic powder7%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
C08LCompositions of macromolecular compounds7%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
G05BControl or regulating systems in general4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (4)· patent assignee history
2021–2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO42021–2024
Locations
LocationPatentsSpan
US42021–2024