Inventor

Thiam B. Lim

Inventor

Singapore, SG

Overview

19→

Patents

1988–2003

Patent span

Electricity

Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%

Y10TTechnical subjects covered by former us classification16%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form9%

C08JWorking-up9%

H05KPrinted circuits6%

B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling3%

H10DInorganic electric semiconductor devices3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

PatentTitleYear

6,621,151'Lead frame for an integrated circuit chip'2003 6,583,501'Lead frame for an integrated circuit chip (integrated circuit peripheral support)'2003 6,540,866'Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate'2003 6,537,411'Method for low temperature lamination of metals to polyimides'2003 6,334,926'Method for low temperature lamination of metals to fluoropolymers'2002 5,925,934'Low cost and highly reliable chip-sized package'1999 5,893,724'Method for forming a highly reliable and planar ball grid array package'1999 5,892,290'Highly reliable and planar ball grid array package'1999 5,773,878'IC packaging lead frame for reducing chip stress and deformation'1998 5,434,106'Integrated circuit device and method to prevent cracking during surface mount'1995 5,319,241'Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution'1994 5,313,102'Integrated circuit device having a polyimide moisture barrier coating'1994 5,229,329'Method of manufacturing insulated lead frame for integrated circuits'1993 5,227,232'Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution'1993 5,206,536'Comb insert for semiconductor packaged devices'1993 5,164,815'Integrated circuit device and method to prevent cracking during surface mount'1992 5,155,578'Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages'1992 5,146,312'Insulated lead frame for semiconductor packaged devices'1992 4,745,787'Plug drawing'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–2003Based in Singapore, SG· patent location history

1992–1995Patents assigned to TEXAS INSTRUMENTS INC (7)· patent assignee history

1992–1993Patents assigned to LIM THIAM B (2)· patent assignee history

1992–1994Based in Pasir Ris, SG· patent location history

1998Patents assigned to INST OF MICROELECTRONICS NATIO (1)· patent assignee history

1998Based in Toh Crescent, SG· patent location history

1999–2003Patents assigned to INST OF MICROELECTRONICS (7)· patent assignee history

1999Based in Crescent, SG· patent location history

2003Patents assigned to UNIV SINGAPORE (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INST OF MICROELECTRONICS	7	1999–2003
TEXAS INSTRUMENTS INC	7	1992–1995
LIM THIAM Bself	2	1992–1993
UNIV SINGAPORE	2	2003
INST OF MICROELECTRONICS NATIO	1	1998

Locations

Location	Patents	Span
Singapore, SG	13	1988–2003
Pasir Ris, SG	4	1992–1994
Crescent, SG	1	1999
Toh Crescent, SG	1	1998