Inventor
Ming-Liang Hsieh
Inventor
Hsinchu, TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering20%
H01FMagnets20%
H03HImpedance networks, e.g. resonant circuits20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000Patents assigned to IND TECH RES INST (2)· patent assignee history
2000Based in Hsinchu, TW· patent location history
2010Patents assigned to INPAQ TECHNOLOGY CO LTD (1)· patent assignee history
2010Based in Tainan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 2 | 2000 |
| INPAQ TECHNOLOGY CO LTD | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 2 | 2000 |
| Tainan, TW | 1 | 2010 |