Inventor
Klaus Kretzschmar
Inventor
Erlangen, DE
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds42%
H01BCables32%
C08LCompositions of macromolecular compounds11%
B29CShaping or joining of plastics5%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
PatentTitleYear
6,225,377'Blending epoxy resin-polyisocyanate-filler mixture and phenolic resin-filler mixture for molding'20015,919,843'Epoxy resin moulding compounds having halogen-free flame retardation'19995,496,892'Oxazolidinone structures-containing prepolymeric epoxy resin mixture'19964,631,306'Method for the manufacture of molded materials'19864,582,723'Heat-hardenable reaction resin mixtures for impregnating and embedding'19864,578,452'Method for manufacturing epoxy resin molded materials'19864,562,227'Heat-hardenable reaction resin mixtures comprising polyfunctional epoxide, polyisocyanate prepolymer and a reaction accelerator which is either a tertiary amine or an imidazole'19854,528,358'Method for the manufacture of epoxy resin molding materials'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–2001Patents assigned to SIEMENS AG (8)· patent assignee history
1985–2001Based in Erlangen, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 8 | 1985–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Erlangen, DE | 8 | 1985–2001 |