LexDanaLexDanabeta
Inventor

Yoshihisa Yamashita

Inventor
Kyoto, JP

Overview

84→
Patents
1999–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 84 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y02PClimate change mitigation technologies in the production or processing of goods7%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
B41JTypewriters4%
H01LSemiconductor devices4%
H10HInorganic light-emitting semiconductor devices having potential barriers4%
H10KOrganic electric solid-state devices4%
PatentTitleYear
10,125,283Ink, ink cartridge, and ink jet recording method201810,022,981Ink, ink cartridge, and ink jet recording method20189,956,761Ink, ink cartridge, and ink jet recording method20189,825,209'Electronic component package and method for manufacturing the same'20179,751,240'Resin vehicle part manufacturing method and resin vehicle part'20179,627,583'Light-emitting device and method for manufacturing the same'20179,595,651'Electronic component package and method for manufacturing same'20179,541,518'Electrochemical detector and method for producing same'20179,449,944'Electronic component package and method for manufacturing same'20169,449,937'Semiconductor device and method for manufacturing the same'20169,425,122'Electronic component package and method for manufacturing the same'20169,368,469'Electronic component package and method of manufacturing same'20169,330,811'Transparent electrode and method for manufacturing the same'20169,320,155'Ceramic substrate composite and method for manufacturing ceramic substrate composite'20169,236,338'Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package'20168,960,879'Ink jet ink, ink cartridge, and ink jet recording method'20158,883,617'Method for manufacturing a metal oxide semiconductor'20148,709,293'Flip-chip mounting resin composition and bump forming resin composition'20148,617,943'Method for making a semiconductor device on a flexible substrate'20138,389,600'Ink jet recording method, and ink jet recording apparatus'20138,288,778'Semiconductor device having semiconductor elements formed inside a resin film substrate'20128,283,246'Flip chip mounting method and bump forming method'20128,193,526'Transistor having an organic semiconductor with a hollow space'20128,143,617'Semiconductor device, semiconductor device manufacturing method and image display device'20128,071,425'Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus'20118,039,307'Mounted body and method for manufacturing the same'20118,012,801'Flip chip mounting process and flip chip assembly'20118,011,777'Ink set, ink jet recording method, ink cartridge, recording unit, and ink jet recording apparatus'20117,981,528'Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same'20117,977,741'Manufacturing method of flexible semiconductor device and flexible semiconductor device'20117,959,280'Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus'20117,951,700'Flip chip mounting method and bump forming method'20117,921,551'Electronic component mounting method'20117,911,064'Mounted body and method for manufacturing the same'20117,909,449'Ink jet recording apparatus and ink jet recording method'20117,888,789'Transfer material used for producing a wiring substrate'20117,875,496'Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body'20117,851,281'Manufacturing method of flexible semiconductor device and flexible semiconductor device'20107,799,607'Process for forming bumps and solder bump'20107,773,386'Flexible substrate, multilayer flexible substrate'20107,759,162'Flip chip mounting process and flip chip assembly'20107,732,920'Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus'20107,731,346'Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus'20107,713,787'Mounted body and method for manufacturing the same'20107,671,464'Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board'20107,611,040'Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition'20097,560,236'Microbial community analysis'20097,531,754'Flexible substrate having interlaminar junctions, and process for producing the same'20097,394,663'Electronic component built-in module and method of manufacturing the same'20087,321,496'Flexible substrate, multilayer flexible substrate and process for producing the same'20087,314,276'Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus'20087,300,505'Ink-jet recording ink, ink cartridge, recording unit, ink-jet recording method, ink-jet recording apparatus, and method for stabilizing ink ejection'20077,247,178'Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same'20077,242,086'Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device'20077,241,333'Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatus'20077,205,483'Flexible substrate having interlaminar junctions, and process for producing the same'20077,140,104'Method of producing circuit component built-in module with embedded circuit component'20067,126,811'Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same'20067,087,467'Lead frame and production process thereof and production process of thermally conductive substrate'20067,059,042'Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink'20067,041,535'Power module and method of manufacturing the same'20067,033,865'Thermally conductive substrate, thermally conductive substrate manufacturing method and power module'20067,022,276'Method for manufacturing circuit board and circuit board and power conversion module using the same'20066,964,700'Ink for use in ink jet recording and ink jet recording method utilizing the same'20056,958,535'Thermal conductive substrate and semiconductor module using the same'20056,936,774'Wiring substrate produced by transfer material method'20056,930,395'Circuit substrate having improved connection reliability and a method for manufacturing the same'20056,921,433'Aqueous dispersion of water-insoluble-colorant-containing particle and preparation process thereof, water-insoluble-colorant-containing particle and preparation process thereof, and ink'20056,871,396'Transfer material for wiring substrate'20056,870,244'Lead frame and production process thereof and production process of thermally conductive substrate'20056,860,004'Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink'20056,787,884'Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production'20046,707,671'Power module and method of manufacturing the same'20046,700,182'Thermally conductive substrate, thermally conductive substrate manufacturing method and power module'20046,692,818'Method for manufacturing circuit board and circuit board and power conversion module using the same'20046,570,099'Thermal conductive substrate and the method for manufacturing the same'20036,522,555'Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein'20036,522,405'Method and apparatus for monitoring sub-micron particles'20036,501,527'Liquid crystal elemental device, production process thereof and spacer-bearing substrate'20026,399,257'Color filter manufacturing method, color filter manufactured by the method, and liquid crystal device employing the color filter'20026,339,461'Method for forming spacers, manufacturing method for a color filter having the spacers, and liquid crystal element formed by using the manufacturing method'20026,248,482'Ink, color filter, liquid crystal panel, and computer, and process for producing color filter'20016,203,604'Ink, color filter, liquid crystal panel, and computer, and process for producing color filter'20015,886,109'AZO group-containing high molecular weight compound for block copolymerization'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2003Based in Osaka, JP· patent location history
2001–2018Patents assigned to CANON KK (19)· patent assignee history
2001–2018Based in Kawasaki, JP· patent location history
2002–2008Based in Kanagawa, JP· patent location history
2003–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (24)· patent assignee history
2003–2017Based in Kyoto, JP· patent location history
2009–2017Patents assigned to PANASONIC CORP (28)· patent assignee history
2011–2015Patents assigned to YAMASHITA YOSHIHISA (10)· patent assignee history
2016–2017Patents assigned to PANASONIC IP MAN CO LTD (11)· patent assignee history
2017Based in Kariya, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PANASONIC CORP282009–2017
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD242003–2008
CANON KK192001–2018
PANASONIC IP MAN CO LTD112016–2017
YAMASHITA YOSHIHISAself102011–2015
Locations
LocationPatentsSpan
Kyoto, JP612003–2017
Kawasaki, JP152001–2018
Kanagawa, JP42002–2008
Osaka, JP21999–2003
Kariya, JP12017