Inventor
MENG-SHENG CHANG
Inventor
TW
Overview
Patents· 139 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G11Cprimary
G11CStatic stores21%
H10BElectronic memory devices19%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10DInorganic electric semiconductor devices13%
G06FElectric digital data processing6%
B82YSpecific uses or applications of nanostructures2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
H03KPulse technique1%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
PatentTitleYear
12,597,466Semiconductor memory devices with differential threshold voltages202612,592,293Semiconductor device and method for manufacturing the same202612,588,512Generation of physically unclonable function using one-time-programmable memory devices with backside interconnect structures202612,588,295Capacitor and method for forming the same202612,563,722Integrated circuit and method of forming the same202612,563,721Memory device and method for forming the same202612,563,723Efuse cells with backside power rails202612,564,061Generation of physically unclonable function using one-time-programmable memory devices with back-end-of-line transistors202612,548,620Memory device and operating method thereof202612,531,118Memory device with physical unclonable function and operating method thereof202612,531,117Semiconductor device and programmable macro circuit202612,489,051One-time-programmable memory device including an antifuse structure and methods of forming the same202512,464,811Memory devices and methods of manufacturing thereof202512,463,151PUF memory devices and methods of manufacturing thereof202512,423,494Memory device with improved anti-fuse read current202512,412,620Second word line combined with y-mux signal in high voltage memory program202512,406,702Switches to reduce routing rails of memory system202512,406,741Semiconductor memory devices with backside heater structure202512,406,923One-time-programmable memory device including an antifuse structure and methods of forming the same202512,396,168One-time programmable memory device202512,394,457Memory cell and method of forming the memory cell202512,380,959Memory device and methods202512,382,714Memory devices and methods of manufacturing thereof202512,374,396Memory including metal rails with balanced loading202512,361,192Memory device, integrated circuit device and method202512,356,683Semiconductor memory devices with dielectric fin structures202512,354,950MIM efuse memory devices and memory array using a metal-based layer between structures202512,347,771Semiconductor device having fuse array and method of making the same202512,349,423Memory devices and methods of manufacturing thereof202512,341,093Method for protecting anti-fuse cell202512,324,149Metal fuse structure by via landing202512,315,561Semiconductor memory devices with different word lines202512,300,603Modified fuse structure and method of use202512,293,799Memory circuit and method of operating same202512,284,804Memory devices, semiconductor devices, and methods of operations a memory device202512,283,951Voltage provision circuits with core transistors202512,277,990Memory device and method of operating the same202512,256,539One-time-programmable memory devices having first transistor, second transistor, and resistor in series202512,243,816Semiconductor structure havbing an enhanced E-fuse and a method making the same202512,243,618Method of manufacturing semiconductor device202512,237,264Fusible structures202512,230,359Semiconductor device202512,230,681Semiconductor memory devices with different doping types202512,224,238MIM eFuse memory devices and memory array202512,218,047Memory devices and methods of manufacturing thereof202512,217,798Bank design with differential bulk bias in eFuse array202512,219,755Anti-fuse device and method202512,211,568Multi-fuse memory cell circuit and method202512,205,648Three-dimensional one time programmable memory202512,205,891Methods of manufacturing fusible structures202512,198,785Semiconductor memory devices with dielectric fin structures202512,193,223Memory device with improved anti-fuse read current202512,193,204Memory devices and methods of manufacturing thereof202512,190,927Memory device with a bias circuit202512,176,049MIM eFuse memory devices and fabrication method thereof202412,165,865Efuse with fuse walls and method of manufacturing the same202412,148,487High-density and high-voltage-tolerable pure core memory cell202412,112,829Memory array circuits, memory structures, and methods for fabricating a memory array circuit202412,094,558Multiple stack high voltage circuit for memory202412,087,378Bit selection for power reduction in stacking structure during memory programming202412,089,402Integrated circuit layout and method202412,080,641Electrical fuse bit cell in integrated circuit having backside conducting lines202412,073,169Anti-fuse array202412,075,614MIM memory cell with backside interconnect structures202412,062,408Switches to reduce routing rails of memory system202412,063,773Layout structure including anti-fuse cell202412,052,859Non-volatile memory device with reduced area202412,051,464Semiconductor memory devices with different word lines202412,048,147Layout structure including anti-fuse cell202412,027,221Integrated circuit device202412,027,204Memory including metal rails with balanced loading202412,014,796Memory device and method of operating the same202412,010,833Method and structure for reduce OTP cell area and leakage202412,002,802Capacitor and method for forming the same202411,990,183Memory system with physical unclonable function202411,985,819Layout method by buried rail for centralized anti-fuse read current202411,978,509Semiconductor memory devices with differential threshold voltages202411,963,348Integrated circuit read only memory (ROM) structure202411,956,947One-time programmable memory device202411,955,201Memory device202411,950,411Semiconductor memory devices with dielectric fin structures202411,942,168EFuse structure and method202411,942,155Semiconductor memory devices with dielectric fin structures202411,903,188Memory devices, semiconductor devices, and methods of operating a memory device202411,856,762Memory devices and methods of manufacturing thereof202311,856,761Semiconductor memory devices with different doping types202311,854,968Modified fuse structure and method of use202311,854,616Memory including metal rails with balanced loading202311,849,574Layout structure of storage cell and manufacturing method thereof202311,844,209Memory cell and method of forming the memory cell202311,842,781Layout structures of memory array and related methods202311,837,300Multi-fuse memory cell circuit and method202311,837,539Electrical fuse bit cell in integrated circuit having backside conducting lines202311,830,827Semiconductor memory devices with dielectric fin structures202311,823,769Reducing capacitive loading of memory system based on switches202311,817,160One-time programmable memory bit cell202311,803,683Method of and system for manufacturing semiconductor device202311,791,005Memory circuit and method of operating same202311,783,107Integrated circuit structure202311,785,766E-fuse202311,763,875Second word line combined with Y-MUX signal in high voltage memory program202311,756,640MIM efuse memory devices and fabrication method thereof202311,758,715System and method for reducing cell area and current leakage in anti-fuse cell array202311,756,622Bank design with differential bulk bias in eFuse array202311,756,591Switches to reduce routing rails of memory system202311,723,194Integrated circuit read only memory (ROM) structure202311,703,650Optical fiber protection system202311,696,437Integrated circuit device202311,682,433Multiple stack high voltage circuit for memory202311,664,081Bit selection for power reduction in stacking structure during memory programming202311,658,114Fusible structures and methods of manufacturing same202311,653,492Memory devices and methods of manufacturing thereof202311,626,368Semiconductor device having fuse array and method of making the same202311,621,046EFuse circuit, method, layout, and structure202311,605,639One-time-programmable memory device including an antifuse structure and methods of forming the same202311,600,626Semiconductor device including anti-fuse cell202311,569,249Anti-fuse device method and layout202311,569,248Integrated circuit including eFuse cell202311,562,998Capacitor and method for forming the same202311,563,014Memory devices and methods of manufacturing thereof202311,563,015Memory devices and methods of manufacturing thereof202311,532,752Non-volatile memory device with reduced area202211,527,541System and method for reducing resistance in anti-fuse cell202211,501,051Memory device, integrated circuit device and method202211,443,819Memory device, integrated circuit device and method202211,437,386System and method for reducing cell area and current leakage in anti-fuse cell array202211,422,445Projector with temperature sensor and projector protection method202211,423,960Memory device202211,410,926E-fuse enhancement by underlayer layout design202211,410,740Multi-fuse memory cell circuit and method202211,380,693Semiconductor device including anti-fuse cell structure202211,342,341Integrated circuit layout, method, structure, and system202211,335,424One-time programmable memory bit cell202211,315,936Memory device and manufacturing method thereof202211,257,827Layout structure including anti-fuse cell202211,257,757Semiconductor device having fuse array and method of making the same202211,250,923Layout structures of memory array202211,211,134Efuse circuit, method, layout, and structure202111,176,969Memory circuit including a first program device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (136)· patent assignee history
2021–2026Based in TW· patent location history
2022–2023Patents assigned to DELTA ELECTRONICS INC (2)· patent assignee history
2022Patents assigned to TAIWAN SEMICONDUCTOH MANUFACTUHING COMPANY LTD (1)· patent assignee history
2023Patents assigned to TAIWAN SEMICONDUCTOR MFG LIMITED (1)· patent assignee history
2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 136 | 2021–2026 |
| DELTA ELECTRONICS INC | 2 | 2022–2023 |
| TAIWAN SEMICONDUCTOH MANUFACTUHING COMPANY LTD | 1 | 2022 |
| TAIWAN SEMICONDUCTOR MFG COMPANY LTD | 1 | 2026 |
| TAIWAN SEMICONDUCTOR MFG LIMITED | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 139 | 2021–2026 |