Inventor
Yukihiro Satou
Inventor
Takasaki, JP
Overview
Patents· 38 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10DInorganic electric semiconductor devices16%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems11%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications11%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification7%
A47BTables6%
A47FSpecial furniture, fittings, or accessories for shops, storehouses, bars, restaurants or the like6%
H01LSemiconductor devices5%
H03KPulse technique2%
PatentTitleYear
10,490,486Semiconductor device201910,115,658Semiconductor device20189,824,996'Semiconductor device having low on resistance'20179,496,204'Semiconductor device'20169,412,701'Semiconductor device including a DC-DC converter'20169,165,901'Semiconductor device'20159,129,946'Semiconductor device'20158,796,827'Semiconductor device including a DC-DC converter'20148,796,838'Semiconductor device'20148,698,289'Semiconductor device, a method of manufacturing the same and an electronic device'20148,618,642'Semiconductor device'20138,581,396'Semiconductor device'20138,422,261'Semiconductor device and power supply device using the same'20138,350,372'Semiconductor device including a DC-DC converter'20138,344,459'Semiconductor device'20138,304,890'Semiconductor device'20128,237,493'Semiconductor device and power supply device using the same'20128,159,054'Semiconductor device'20128,067,979'Semiconductor device and power supply device using the same'20118,044,468'Semiconductor device'20118,044,509'Semiconductor device'20118,022,518'Semiconductor device having a sealing body and partially exposed conductors'20118,013,430'Semiconductor device including DC-DC converter'20117,928,589'Semiconductor device'20117,911,054'Semiconductor device'20117,800,215'Semiconductor device'20107,782,025'Semiconductor device and power supply device using the same'20107,728,416'Semiconductor device, a method of manufacturing the same and an electronic device'20107,554,209'Semiconductor device having a metal plate conductor'20097,554,181'Semiconductor device with non-overlapping chip mounting sections'20097,541,672'Semiconductor device'20097,518,156'Semiconductor device'20097,480,163'Semiconductor device and power supply device using the same'20097,274,103'Semiconductor device and manufacturing method thereof'20077,256,501'Semiconductor device and manufacturing method of the same'20077,084,491'Semiconductor device'20066,992,385'Semiconductor device, a method of manufacturing the same and an electronic device'20066,713,849'Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2016Patents assigned to HITACHI HOKKAI SEMICONDUCTOR (6)· patent assignee history
2004–2019Based in Takasaki, JP· patent location history
2006–2010Patents assigned to RENESAS TECH CORP (11)· patent assignee history
2010–2019Patents assigned to RENESAS ELECTRONICS CORP (25)· patent assignee history
2011–2014Patents assigned to SATOU YUKIHIRO (10)· patent assignee history
2011–2013Patents assigned to MATSUURA NOBUYOSHI (6)· patent assignee history
2013Based in Kanagawa, JP· patent location history
2014–2017Based in Kawasaki, JP· patent location history
2016Based in Taksaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 25 | 2010–2019 |
| RENESAS TECH CORP | 11 | 2006–2010 |
| SATOU YUKIHIROself | 10 | 2011–2014 |
| HITACHI HOKKAI SEMICONDUCTOR | 6 | 2004–2016 |
| MATSUURA NOBUYOSHI | 6 | 2011–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Takasaki, JP | 32 | 2004–2019 |
| Kawasaki, JP | 4 | 2014–2017 |
| Taksaki, JP | 1 | 2016 |
| Kanagawa, JP | 1 | 2013 |