Inventor
LEI WEI
Inventor
US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Tprimary
G06TImage data processing or generation, in general14%
H04NPictorial communication, e.g. television14%
H10BElectronic memory devices13%
H10NElectric solid-state devices not otherwise provided for13%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
G06FElectric digital data processing5%
G11CStatic stores5%
B25JManipulators3%
G05GControl devices or systems insofar as characterised by mechanical features only3%
PatentTitleYear
12,515,931Automated guided forklift, method for controlling automated guided forklift, and controller202612,491,638Bilateral teleoperation system and control method202512,432,341Methods for intra prediction, and encoder202512,386,367Map construction method, controller, and autonomous mobile machine202512,387,382Point cloud encoding and decoding method, and decoder202512,346,501Haptic feedback device, electronic device, and robot system202512,266,140Methods for level partition of point cloud, and decoder202512,225,241Intra prediction method and decoder for geometric-based point cloud coding202512,144,188Multitier arrangements of integrated devices, and methods of forming sense/access lines202412,079,381Motion platform, haptic feedback device and human-computer interactive system202412,082,425Efficient fabrication of memory structures202412,080,034Attribute information prediction method, encoder, decoder and storage medium202412,026,920Point cloud encoding and decoding method, encoder and decoder202411,983,905Methods for level partition of point cloud, and decoder202411,936,850Methods for intra prediction, and encoder202411,830,816Reduced resistivity for access lines in a memory array202311,778,837Memory with optimized resistive layers202311,704,840Attribute information prediction method, encoder, decoder and storage medium202311,626,452Efficient fabrication of memory structures202311,616,098Three-dimensional memory arrays, and methods of forming the same202311,600,666Multitier arrangements of integrated devices, and methods of forming sense/access lines202311,483,132Generating and initiating pre-signed transaction requests for flexibly and efficiently implementing secure cryptographic key management202211,380,732Memory with optimized resistive layers202211,355,554Sense lines in three-dimensional memory arrays, and methods of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to MICRON TECHNOLOGY INC (9)· patent assignee history
2022Patents assigned to META PLATFORMS INC (1)· patent assignee history
2022–2026Based in US· patent location history
2023–2025Patents assigned to GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (9)· patent assignee history
2023–2025Based in CN· patent location history
2024–2025Patents assigned to TENCENT TECH SHENZHEN CO LTD (3)· patent assignee history
2025–2026Patents assigned to VISIONNAV ROBOTICS USA INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD | 9 | 2023–2025 |
| MICRON TECHNOLOGY INC | 9 | 2022–2024 |
| TENCENT TECH SHENZHEN CO LTD | 3 | 2024–2025 |
| VISIONNAV ROBOTICS USA INC | 2 | 2025–2026 |
| META PLATFORMS INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 12 | 2022–2026 |
| CN | 12 | 2023–2025 |