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Inventor

Yuan-Chih Hsieh

Inventor
Hsinchu, TW

Overview

3→
Patents
2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems20%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G11CStatic stores10%
H10BElectronic memory devices10%
PatentTitleYear
11,084,715Segmented pedestal for mounting device on chip202111,078,075Packaging method and associated packaging structure202110,978,122Memory including non-volatile cells and current driving circuit2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Patents assigned to UNITED MICROELECTRONICS CORP (1)· patent assignee history
2021Based in Hsinchu, TW· patent location history
2021Based in Tainan, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22021
UNITED MICROELECTRONICS CORP12021
Locations
LocationPatentsSpan
Hsinchu, TW22021
Tainan, TW12021