Inventor
Jumpei Fujikata
Inventor
Tokyo, JP
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings34%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
LOC137%
C23CCoating metallic material4%
G01MTesting static or dynamic balance of machines or structures4%
LOC153%
B01FMixing, e.g. dissolving, emulsifying or dispersing2%
B08BCleaning in general2%
PatentTitleYear
11,047,063Plating apparatus and plating method202110,954,603Substrate holder, plating apparatus, plating method, and electric contact202110,946,351Paddle, plating apparatus equipped with the paddle, and plating method202110,914,019Plating apparatus and plating method202110,914,020Wave absorbing member attachable to paddle and plating apparatus including wave absorbing member202110,910,334Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium202110,865,492Plating method and plating apparatus2020D0892747Electrical contact202010,676,838Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method2020D0884650Electrical contact202010,641,677Plating method and plating apparatus202010,633,757Plating apparatus, plating method, and recording medium202010,607,842Electrolytic plating apparatus202010,577,714Plating apparatus and plating method202010,577,713Substrate holder, plating apparatus, and method for manufacturing substrate holder202010,533,262Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method202010,508,352Method and apparatus for processing a substrate201910,508,354Feeder capable of feeding anode and plating apparatus201910,487,415Method of adjusting plating apparatus, and measuring apparatus201910,309,030Plating method and plating apparatus201910,294,578Plating apparatus and plating method201910,273,594Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method201910,119,198Method of cleaning substrate holder201810,113,246Substrate holder, plating apparatus, and plating method201810,100,424Method of adjusting plating apparatus, and measuring apparatus201810,047,454Plating apparatus and plating method20189,972,510Substrate cleaning apparatus and substrate cleaning method20189,611,563'Plating method and plating apparatus'20179,376,760'Plating apparatus and method of cleaning substrate holder'2016D0758973'Electrical contact for use in a plating apparatus'20169,340,891'Plating method and plating apparatus'20169,297,088'Electroplating method and electroplating apparatus for through-hole'20169,175,416'Substrate holder and plating apparatus'2015D0742329'Electrical contact for use in a plating apparatus'2015RE045687'Plating apparatus and plating method'2015D0725600'Electrical contact for use in a plating apparatus'20158,864,965'Substrate holder and plating apparatus'2014D0705280'Sealing ring'20148,486,234'Plating apparatus and plating method'2013D0669439'Electrical contact'20128,177,944'Plating apparatus and plating method'2012D0659175'Sealing ring'2012D0651178'Electrical contact for use in a plating apparatus'2011D0649986'Sealing ring'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to EBARA CORP (44)· patent assignee history
2011–2014Patents assigned to FUJIKATA JUMPEI (7)· patent assignee history
2011–2014Patents assigned to ARAKI YUJI (5)· patent assignee history
2011–2014Patents assigned to KIMURA MASAAKI (4)· patent assignee history
2011–2021Based in Tokyo, JP· patent location history
2012–2013Patents assigned to KAMIMURA KENJI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 44 | 2011–2021 |
| FUJIKATA JUMPEIself | 7 | 2011–2014 |
| ARAKI YUJI | 5 | 2011–2014 |
| KIMURA MASAAKI | 4 | 2011–2014 |
| KAMIMURA KENJI | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 44 | 2011–2021 |