Inventor
Akira Fukuizumi
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1071%
H01BCables14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
6,849,930'Semiconductor device with uneven metal plate to improve adhesion to molding compound'20056,747,360'Conductive hardening resin for a semiconductor device and semiconductor device using the same'20046,733,695'Electrically conductive paste and semiconductor device prepared by using the paste'20046,720,647'Semiconductor device and method of manufacturing the same'20046,613,829'Conductive hardening resin for a semiconductor device and semiconductor device using the same'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2004Patents assigned to NEC ELECTRONICS CORP (3)· patent assignee history
2003–2004Patents assigned to SUMITOMO BAKELITE CO (3)· patent assignee history
2003–2005Based in Tokyo, JP· patent location history
2005Patents assigned to NEC CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC ELECTRONICS CORP | 3 | 2003–2004 |
| SUMITOMO BAKELITE CO | 3 | 2003–2004 |
| NEC CORP | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 5 | 2003–2005 |