Inventor
Michael J. Palmer
Inventor
Walden, NY, US
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H05KPrinted circuits18%
B23KSoldering or unsoldering13%
Y10TTechnical subjects covered by former us classification12%
G06FElectric digital data processing7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G11CStatic stores4%
G01KMeasuring temperature2%
G01MTesting static or dynamic balance of machines or structures2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
PatentTitleYear
11,102,582Audio transducers and devices incorporating the same202111,023,400High performance DMA transfers in host bus adapters202110,169,140Loading a phase-locked loop (PLL) configuration using flash memory201910,067,032Back-up and restoration of data between volatile and flash memory20189,870,165'Back-up and restoration of data between volatile and flash memory'20189,870,299'Logic circuit for the gathering of trace data'20189,632,715'Back-up and restoration of data between volatile and flash memory'20179,501,404'Back-up and restoration of data between volatile and flash memory'20169,501,356'Fast data back-up and restore between volatile and flash memory'20166,734,363'Lightweight electronic equipment conductor with coolant permeable support'20046,467,001'VLSI chip macro interface'20026,403,892'Coated means for connecting a chip and a card'20026,295,128'Optical alignment of superpositioned objects'20015,948,286'Diffusion bonding of lead interconnections using precise laser-thermosonic energy'19995,915,462'High efficiency thermal interposer'19995,847,926'Lightweight packaging'19985,768,770'Electronic packaging shaped beam lead fabrication'19985,734,196'Electronic packaging shaped beam lead fabrication'19985,687,078'Fine pitch bonding'19975,676,301'Castellated nozzle and method of use thereof'19975,675,884'Apparatus for multilayer conductor chip packaging'19975,669,437'High efficiency thermal interposer'19975,641,114'Controlled temperature bonding'19975,593,083'Castellated nozzle and method of use therof'19975,546,655'Method of applying flex tape protective coating onto a flex product'19965,503,698'Bonding method employing organometallic interconnectors'19965,450,591'Channel selection arbitration'19955,446,261'Solder application system using helix to control solder meniscus'19955,360,946'Flex tape protective coating'19945,322,204'Electronic substrate multiple location conductor attachment technology'19945,263,620'Wirebond removal apparatus using alternating fluid stream'19935,244,143'Apparatus and method for injection molding solder and applications thereof'19935,242,569'Thermocompression bonding in integrated circuit packaging'19935,233,221'Electronic substrate multiple location conductor attachment technology'19935,229,328'Method for bonding dielectric mounted conductors to semiconductor chip contact pads'19935,205,461'Method and apparatus for fluxless solder bonding'19935,186,632'Electronic device elastomeric mounting and interconnection technology'19935,148,261'Thermocompression bonding in integrated circuit packaging'19925,135,155'Thermocompression bonding in integrated circuit packaging'19925,134,460'Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding'19925,132,351'Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent'19925,120,418'Lead frame plating apparatus for thermocompression bonding'19925,117,275'Electronic substrate multiple location conductor attachment technology'19925,074,969'Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate'19915,052,606'Tape automated bonding feeder'19915,038,195'Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate'19915,006,917'Thermocompression bonding in integrated circuit packaging'19915,006,925'Three dimensional microelectric packaging'19915,003,308'Serial data receiver with phase shift detection'19914,939,570'High power, pluggable tape automated bonding package'19904,937,006'Method and apparatus for fluxless solder bonding'19904,875,614'Alignment device'19894,862,322'Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween'19894,832,255'Precision solder transfer method and means'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2021Patents assigned to IBM (51)· patent assignee history
1989Patents assigned to BICKFORD HARRY R (1)· patent assignee history
1989Patents assigned to BREGMAN MARK F (1)· patent assignee history
1989Patents assigned to KOVAC CAROLINE A (1)· patent assignee history
1989Patents assigned to MOSKOWITZ PAUL A (1)· patent assignee history
1989–2002Based in Walden, NY, US· patent location history
1995–2002Based in North Baddesley, GB· patent location history
1999–2004Based in Auburn, AL, US· patent location history
2016–2021Based in Southampton, GB· patent location history
2021Based in Auckland, NZ· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 51 | 1989–2021 |
| BICKFORD HARRY R | 1 | 1989 |
| BREGMAN MARK F | 1 | 1989 |
| KOVAC CAROLINE A | 1 | 1989 |
| MOSKOWITZ PAUL A | 1 | 1989 |
Locations
| Location | Patents | Span |
|---|---|---|
| Walden, New York, US | 39 | 1989–2002 |
| Southampton, GB | 7 | 2016–2021 |
| Auburn, AL, US | 2 | 1999–2004 |
| North Baddesley, GB | 2 | 1995–2002 |
| Auckland, NZ | 1 | 2021 |