Inventor

Tsai-Yi Lin

Inventor
New Taipei, TW

Overview

9→
Patents
2010–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 9 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics32%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering27%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables9%
G01FMeasuring volume, volume flow, mass flow or liquid level9%
A47BTables5%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%
F16MFrames, casings or beds of engines, machines or apparatus, not specific to engines, machines or apparatus provided for elsewhere5%
G05BControl or regulating systems in general5%
H05KPrinted circuits5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2011Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history
2010Based in Shenkeng Township, TW· patent location history
2011Based in Taipei, TW· patent location history
2016–2020Patents assigned to KINPO ELECT INC (7)· patent assignee history
2016–2020Patents assigned to XYZPRINTING INC (7)· patent assignee history
2016Patents assigned to CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD (1)· patent assignee history
2016–2020Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KINPO ELECT INC72016–2020
XYZPRINTING INC72016–2020
HEWLETT PACKARD DEVELOPMENT CO22010–2011
CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD12016
Locations
LocationPatentsSpan
New Taipei, TW72016–2020
Taipei, TW12011
Shenkeng Township, TW12010