Inventor
Hideya Murai
Inventor
Tokyo, JP
Overview
Patents· 41 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein20%
H05KPrinted circuits18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification6%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
G09GArrangements or circuits for control of indicating devices using static means to present variable information4%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
H01LSemiconductor devices3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
11,110,038Dental polymerizable monomers, compositions, adhesive dental materials and kits20218,975,150'Semiconductor device manufacturing method'20158,929,090'Functional element built-in substrate and wiring substrate'20158,810,008'Semiconductor element-embedded substrate, and method of manufacturing the substrate'20148,766,440'Wiring board with built-in semiconductor element'20148,710,639'Semiconductor element-embedded wiring substrate'20148,569,892'Semiconductor device and manufacturing method thereof'20138,536,691'Semiconductor device and method for manufacturing the same'20138,389,414'Method of manufacturing a wiring board'20138,344,498'Semiconductor device'20138,304,915'Semiconductor device and method for manufacturing the same'20128,198,140'Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package'20128,043,953'Semiconductor device including an LSI chip and a method for manufacturing the same'20118,035,217'Semiconductor device and method for manufacturing same'20117,999,401'Semiconductor device and method of manufacturing same'20117,911,038'Wiring board, semiconductor device using wiring board and their manufacturing methods'20117,838,779'Wiring board, method for manufacturing same, and semiconductor package'20107,816,782'Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package'20107,674,989'Wiring board and method for manufacturing the same'20107,566,834'Wiring board and semiconductor package using the same'20097,495,734'In-plane-switching liquid crystal display unit'20097,397,000'Wiring board and semiconductor package using the same'20087,348,673'Semiconductor device'20087,294,393'Sheet material and wiring board'20076,987,551'In-plane switching liquid crystal display unit having tinting compensation'20066,583,839'In-plane-switching liquid crystal display unit having tinting compensation'20036,466,293'Liquid crystal display with a liquid crystal orientation controlling electrode and processes for manufacturing and driving thereof'20026,456,352'Liquid crystal display device'20026,300,996'Liquid crystal display apparatus'20016,256,082'Liquid crystal display with a liquid crystal orientation controlling electrode and processes for manufacturing and driving thereof'20016,195,144'Multiple domain-divided twisted nematic liquid crystal display with compensation film'20016,177,976'Liquid crystal display'20016,160,604'Liquid crystal display with pixel electrode having aperture containing additional electrode'20006,115,093'Liquid crystal display device having at least two micro areas of liquid crystal layer capable of being built up from a center of each pixel'20006,081,311'Liquid crystal display apparatus having high wide visual angle and high contrast'20005,963,290'Liquid crystal display'19995,959,707'Liquid crystal display having domains with different tilted-up directions as well as domains with different twist directions of lc molecules'19995,796,456'Liquid crystal display with optical negative uni-axial compensation layer'19985,674,576'Liquid crystalline optical device operable at a low drive voltage'19975,409,744'Polymer dispersed liquid crystal optical devices'19954,892,912'Process for producing aromatic polyester'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990Based in Sodegaura, JP· patent location history
1995–2015Patents assigned to NEC CORP (35)· patent assignee history
1995–2015Based in Tokyo, JP· patent location history
2011–2015Patents assigned to RENESAS ELECTRONICS CORP (9)· patent assignee history
2011–2015Based in Minato-ku, JP· patent location history
2012–2015Patents assigned to MURAI HIDEYA (11)· patent assignee history
2012–2015Patents assigned to YAMAMICHI SHINTARO (11)· patent assignee history
2012–2015Patents assigned to MORI KENTARO (10)· patent assignee history
2021Based in Ichihara, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC CORP | 35 | 1995–2015 |
| MURAI HIDEYAself | 11 | 2012–2015 |
| YAMAMICHI SHINTARO | 11 | 2012–2015 |
| MORI KENTARO | 10 | 2012–2015 |
| RENESAS ELECTRONICS CORP | 9 | 2011–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 34 | 1995–2015 |
| Minato-ku, JP | 5 | 2011–2015 |
| Ichihara, JP | 1 | 2021 |
| Sodegaura, JP | 1 | 1990 |