Inventor
ATSUSHI YAMASHITA
Inventor
JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C07Fprimary
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium18%
C23CCoating metallic material18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
C07CAcyclic or carbocyclic compounds7%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C08LCompositions of macromolecular compounds3%
H01LSemiconductor devices3%
B08BCleaning in general1%
B22DCasting of metals1%
B29CShaping or joining of plastics1%
PatentTitleYear
12,583,755Spherical alumina powder, resin composition, and heat dissipation material202612,486,573Thin-film forming raw material, thin-film and method of producing thin-film202512,480,207Tin compound, thin-film forming raw material, thin-film, method for producing thin-film, and halogen compound202512,415,821Tin compound, thin-film forming raw material containing said compound, thin film formed from said thin-film forming raw material, method of producing said thin film using said compound as precursor, and method of producing said thin film202512,378,272Yttrium compound and method of manufacturing integrated circuit device by using the same202512,371,778Cobalt compound, thin-film forming raw material, thin-film, and method of producing thin-film202512,344,931Method of producing copper-containing layer202512,275,748Amidinate compound, dimer compound thereof, thin-film forming raw material, and method of producing thin film202512,104,245Compound, thin-film forming raw material that contains said compound, and method of manufacturing thin film202412,020,943Substrate processing method and substrate processing apparatus202411,945,029Cold flake suppression method202411,814,518Polyamide resin composition202311,644,104Steam valve202311,623,935Raw material for forming thin film by atomic layer deposition method, method of producing thin film, and alkoxide compound202311,618,762Compound, raw material for forming thin film, method for manufacturing thin film, and amidine compound202311,555,044Thin-film forming raw material for use in atomic layer deposition method, thin-film forming raw material, method for producing thin-film, and compound202311,524,973Metal compounds and methods of fabricating semiconductor devices using the same202211,377,824Display system for work vehicle and generation method202211,335,896Method for producing yttrium oxide-containing thin film by atomic layer deposition202211,161,867Compound, raw material for forming thin film, method for manufacturing thin film, and amidine compound2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to ADEKA CORP (14)· patent assignee history
2021–2026Based in JP· patent location history
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2022Patents assigned to KOMATSU MFG CO LTD (1)· patent assignee history
2024Patents assigned to HONDA MOTOR CO LTD (1)· patent assignee history
2026Patents assigned to DENKA COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADEKA CORP | 14 | 2021–2025 |
| SAMSUNG ELECTRONICS CO LTD | 2 | 2022–2025 |
| DENKA COMPANY LTD | 1 | 2026 |
| HONDA MOTOR CO LTD | 1 | 2024 |
| KOMATSU MFG CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 20 | 2021–2026 |