Inventor
YAOLING PAN
Inventor
US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties19%
H01JElectric discharge tubes or discharge lamps15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H01LSemiconductor devices11%
B81BMicrostructural devices or systems, e.g. micromechanical devices7%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
C23CCoating metallic material7%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light6%
G05BControl or regulating systems in general2%
H03KPulse technique2%
PatentTitleYear
12,537,179Capacitive sensing data integration for plasma chamber condition monitoring202612,522,498MEMS and NEMS structures202612,437,979Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring202512,228,534Capacitive sensor for monitoring gas concentration202512,163,911Capacitive sensor housing for chamber condition monitoring202412,123,090Differential capacitive sensor for in-situ film thickness and dielectric constant measurement202412,009,236Sensors and system for in-situ edge ring erosion monitor202412,006,209MEMS and NEMS structures202411,959,868Capacitive sensor for monitoring gas concentration202411,781,214Differential capacitive sensors for in-situ film thickness and dielectric constant measurement202311,685,649Capping plate for panel scale packaging of MEMS products202311,581,206Capacitive sensor for chamber condition monitoring202311,551,905Resonant process monitor202311,545,346Capacitive sensing data integration for plasma chamber condition monitoring202311,415,538Capacitive sensor housing for chamber condition monitoring202211,282,760Integrated packaging devices and methods with backside interconnections2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to APPLIED MATERIALS INC (12)· patent assignee history
2022–2026Patents assigned to OBSIDIAN SENSORS INC (4)· patent assignee history
2022–2026Based in US· patent location history
2023Patents assigned to INTEL CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 12 | 2022–2026 |
| OBSIDIAN SENSORS INC | 4 | 2022–2026 |
| INTEL CORP | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 16 | 2022–2026 |