Inventor
Kai Jen
Inventor
Taichung, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10BElectronic memory devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
11,101,179Semiconductor structure with protection portions and method for forming the same202111,018,140Semiconductor device and method for manufacturing the same202110,998,323Dynamic random access memory202110,998,320Memory structure and method of manufacturing the same202110,083,906Memory device with buried word line for reduced gate-induced drain leakage current and method for manufacturing the same2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2021Patents assigned to WINBOND ELECTRONICS CORP (5)· patent assignee history
2018–2021Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 5 | 2018–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 5 | 2018–2021 |