LexDanaLexDanabeta
Inventor

Mohd Kahar Bajuri

Inventor
MY

Overview

4→
Patents
2021–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,205,874Semiconductor package with wire bond joints202511,842,953Semiconductor package with wire bond joints and related methods of manufacturing202311,705,387Multi-layer interconnection ribbon202311,211,353Clips for semiconductor packages2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2021–2025Based in MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG42021–2025
Locations
LocationPatentsSpan
MY42021–2025