Inventor
Koki Tamura
Inventor
Kawasaki, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
Y10TTechnical subjects covered by former us classification15%
H01LSemiconductor devices14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form12%
C09JAdhesives12%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
C09DCoating compositions, e.g. paints, varnishes or lacquers2%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,793,756Adhesive composition, adhesive film, and bonding method20209,944,049Composition for forming release layer, release layer, laminate including release layer, method of preparing laminate, and method of treating laminate20189,881,829'Adhesive composition, laminate, and stripping method'20189,682,532'Laminated body and method for separating laminated body'20179,607,875'Adhesive composition, laminate, and stripping method'20179,492,986'Laminate and method for separating the same'20169,352,542'Processing method and processing apparatus'20169,308,715'Laminate and method for separating the same'20169,115,297'Adhesive composition'20159,064,915'Support method, high-temperature treatment method using same, and support jig'20159,048,311'Laminate and method for separating the same'20159,017,932'Processed substrate and method for manufacturing same'20158,980,997'Adhesive composition'20158,809,457'Adhesive composition, adhesive film, and method for treating substrate'20148,357,750'Adhesive composition and film adhesive'20138,354,157'Support plate, method for producing the same, and method for processing substrate'20138,333,869'Stripping method and stripping solution'20128,298,365'Sticking method and sticking apparatus'20128,124,685'Adhesive composition and film adhesive'20127,416,832'Positive resist composition'20087,371,510'Material for forming resist protecting film for use in liquid immersion lithography process, composite film, and method for forming resist pattern'20087,318,992'Lift-off positive resist composition'20087,261,994'Positive resist composition'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2020Patents assigned to TOKYO OHKA KOGYO CO LTD (23)· patent assignee history
2007–2020Based in Kawasaki, JP· patent location history
2012–2017Patents assigned to TAMURA KOKI (11)· patent assignee history
2012–2017Patents assigned to IMAI HIROFUMI (9)· patent assignee history
2012–2017Patents assigned to YOSHIOKA TAKAHIRO (8)· patent assignee history
2012–2017Patents assigned to KUBO ATSUSHI (7)· patent assignee history
2017Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO OHKA KOGYO CO LTD | 23 | 2007–2020 |
| TAMURA KOKIself | 11 | 2012–2017 |
| IMAI HIROFUMI | 9 | 2012–2017 |
| YOSHIOKA TAKAHIRO | 8 | 2012–2017 |
| KUBO ATSUSHI | 7 | 2012–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 22 | 2007–2020 |
| Kanagawa, JP | 1 | 2017 |