Inventor
TOSHIYUKI MORIYA
Inventor
JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding8%
B25JManipulators8%
D07BRopes or cables in general8%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure8%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
G01RMeasuring electric variables8%
H01LSemiconductor devices8%
PatentTitleYear
11,872,669Cover to vacuum debris while grinding202411,858,088Polishing apparatus202411,549,911Damage detection method of wire rope, and signal processor and damage detection device used for damage detection of wire rope202311,484,985Processing apparatus202211,480,635Tension measuring method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to DISCO CORP (3)· patent assignee history
2022–2023Patents assigned to TOKYO ROPE MFG CO (2)· patent assignee history
2022Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (1)· patent assignee history
2022Patents assigned to UNIV KYOTO (1)· patent assignee history
2022–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 3 | 2022–2024 |
| TOKYO ROPE MFG CO | 2 | 2022–2023 |
| SUMITOMO ELECTRIC INDUSTRIES | 1 | 2022 |
| UNIV KYOTO | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2022–2024 |