Inventor

Cheng-Feng Liao

Inventor

Taipei, TW

Overview

4→

Patents

2019

Patent span

Performing operations

Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary

G06FElectric digital data processing16%

H05KPrinted circuits16%

B29CShaping or joining of plastics11%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts11%

B29LIndexing scheme associated with subclass b29c, relating to particular articles11%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

C04BLime, magnesia5%

C23CCoating metallic material5%

D06MTreatment, not provided for elsewhere in class d06, of fibres, threads, yarns, fabrics, feathers or fibrous goods made from such materials5%

E05DHinges or suspension devices for doors, windows or wings5%

PatentTitleYear

10,462,920Polymer fiber composite2019 10,401,911Ceramic housing2019 10,331,165Hinge assembly including an elastomer member2019 10,234,905Hinge for foldable components2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (4)· patent assignee history

2019Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	4	2019

Locations

Location	Patents	Span
Taipei, TW	4	2019