Inventor
Yuksel Temiz
Inventor
Zug, CH
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B01Lprimary
B01LChemical or physical laboratory apparatus for general use32%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems15%
G01NInvestigating or analysing materials by determining their chemical or physical properties13%
B03CMagnetic or electrostatic separation of solid materials from solid materials or fluids6%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B05DProcesses for applying fluent materials to surfaces, in general4%
G01FMeasuring volume, volume flow, mass flow or liquid level4%
H01JElectric discharge tubes or discharge lamps4%
H01LSemiconductor devices4%
F16KValves2%
PatentTitleYear
10,722,887Device and method for flow and bead speed characterization in microfluidic devices202010,675,620Fabrication of microfluidic chips having electrodes level with microchannel walls202010,500,586Microfluidic device with anti-wetting, venting areas201910,493,450Microfluidic device with anti-wetting, venting areas201910,444,184Operation of diagnostic devices involving microchannels and electrodes201910,369,567Continuous, capacitance-based monitoring of liquid flows in a microfluidic device201910,345,244Diagnostic test device with patterned material spots201910,159,976Fabrication of microfluidic chips having electrodes level with microchannel walls201810,112,193Fabrication of a microfluidic chip package or assembly with separable chips201810,081,015Trapping at least one microparticle20189,962,714Microchannel, microfluidic chip and method for processing microparticles in a fluid flow20189,917,148'Self-limited, anisotropic wet etching of transverse vias in microfluidic chips'20189,901,926'Microfluidic chip with dielectrophoretic electrodes extending in hydrophilic flow path'20189,770,717'Microfluidic chip with bead integration system'20179,604,209'Microfluidic device with anti-wetting, venting areas'20179,412,728'Post-CMOS processing and 3D integration based on dry-film lithography'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016Patents assigned to ECOLE POLYTECHNIQUE FED DE LAUSANNE (EPFL) (1)· patent assignee history
2016–2020Based in Zug, CH· patent location history
2017–2020Patents assigned to IBM (15)· patent assignee history
2018–2020Patents assigned to UNITEC SEMICONDUCTORES S A (2)· patent assignee history
2018Patents assigned to IBM RES GMBH (1)· patent assignee history
2018Patents assigned to SIX SEMICONDUTORES (1)· patent assignee history
2018–2020Based in Rueschlikon, CH· patent location history
2018Based in Lüssiweg, CH· patent location history
2019Based in Lüssiweg, CH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 15 | 2017–2020 |
| UNITEC SEMICONDUCTORES S A | 2 | 2018–2020 |
| ECOLE POLYTECHNIQUE FED DE LAUSANNE (EPFL) | 1 | 2016 |
| IBM RES GMBH | 1 | 2018 |
| SIX SEMICONDUTORES | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Zug, CH | 8 | 2016–2020 |
| Rueschlikon, CH | 5 | 2018–2020 |
| Lüssiweg, CH | 2 | 2018 |
| Lüssiweg, CH | 1 | 2019 |