Inventor
KUO-CHAN HUANG
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10DInorganic electric semiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
B26BHand-held cutting tools not otherwise provided for8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
LOC088%
PatentTitleYear
12,343,886Boxcutter2025D1058327Saw202512,183,629Selective hybrid capping layer for metal gates of transistors202411,916,146Gate resistance reduction through low-resistivity conductive layer202411,532,509Selective hybrid capping layer for metal gates of transistors202211,302,818Gate resistance reduction through low-resistivity conductive layer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
2022–2025Based in TW· patent location history
2025Patents assigned to INDUSTRO INT CO LTD (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2022–2024 |
| INDUSTRO INT CO LTD | 2 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2022–2025 |