LexDanaLexDanabeta
Inventor

Yueh-Liang Liu

Inventor
Hsinchu, TW

Overview

2→
Patents
2002–2004
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10100%
PatentTitleYear
6,780,780'Method for removing Si-needles of wafer'20046,395,646'Machine for etching the edge of a wafer and method of etching the edge of a wafer'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2004Patents assigned to WINBOND ELECTRONICS CORP (2)· patent assignee history
2002–2004Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
WINBOND ELECTRONICS CORP22002–2004
Locations
LocationPatentsSpan
Hsinchu, TW22002–2004