Inventor
Hideaki Terauchi
Inventor
Kawasaki, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus19%
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification19%
H01RElectrically-conductive connections13%
Y02PClimate change mitigation technologies in the production or processing of goods13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
7,469,457'Method of removing integrated circuit chip package and detachment jig therefor'20086,996,301'Optical module and fiber sheet'20066,968,097'Fiber sheet and manufacturing method therefor'20056,890,109'Optical fiber splicer and optical fiber splicing method'20056,655,990'Method of surface mounting a connector and connector'20036,081,998'Method of surface mounting a connector'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2008Patents assigned to FUJITSU LTD (5)· patent assignee history
2000–2008Based in Kawasaki, JP· patent location history
2005Patents assigned to FUJIKURA LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 5 | 2000–2008 |
| FUJIKURA LTD | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 6 | 2000–2008 |