Inventor
SHIH-PEI CHOU
Inventor
TW
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation21%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
Y02PClimate change mitigation technologies in the production or processing of goods3%
PatentTitleYear
12,456,661Semiconductor structure having a silicon active layer formed over a SiGe etch stop layer and an insulating layer with a through silicon via (TSV) passed therethrough202512,424,577Isolation structure for bond pad structure202512,419,124Method for forming light pipe structure with high quantum efficiency202512,400,984Isolation structure for bond pad structure202512,341,115Bond pad structure with reduced step height and increased electrical isolation202512,317,613Self aligned grids in BSI image sensor202512,165,911Method for forming a semiconductor-on-insulator (SOI) substrate202412,087,801Deep trench isolations and methods of forming the same202411,915,977Interconnect structure for stacked device202411,894,410Bond pad structure for bonding improvement202411,855,159Method for forming thin semiconductor-on-insulator (SOI) substrates202311,830,764Method for forming a semiconductor-on-insulator (SOI) substrate202311,776,985Method of forming self aligned grids in BSI image sensor202311,769,778Method for forming light pipe structure with high quantum efficiency202311,694,979Isolation structure for bond pad structure202311,522,004Absorption enhancement structure for image sensor202211,495,489Method for forming a semiconductor-on-insulator (SOI) substrate202211,309,342Dummy vertical transistor structure to reduce cross talk in pixel sensor202211,264,469Method for forming thin semiconductor-on-insulator (SOI) substrates202211,244,981Bond pad structure for bonding improvement202211,217,621Deep trench isolations and methods of forming the same202211,217,547Bond pad structure with reduced step height and increased electrical isolation202211,189,583Semiconductor structure and manufacturing method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (23)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 23 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 23 | 2021–2025 |