Inventor
Ji Hwang Kim
Inventor
Cheonan-si, KR
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Kprimary
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients25%
C08LCompositions of macromolecular compounds25%
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
11,069,592Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure20219,382,418'Flame retardant thermoplastic resin composition and molded article comprising the same'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016Patents assigned to SAMSUNG SDI CO LTD (1)· patent assignee history
2016Based in Uiwang-si, KR· patent location history
2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
2021Based in Cheonan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 1 | 2021 |
| SAMSUNG SDI CO LTD | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 1 | 2021 |
| Uiwang-si, KR | 1 | 2016 |