Inventor

Daniel J. Buvid

Inventor
Rochester, MN, US

Overview

28→
Patents
2015–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H05KPrinted circuits11%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering4%
B60WConjoint control of vehicle sub-units of different type or different function4%
F16HGearing4%
G01CMeasuring distances, levels or bearings4%
G02BOptical elements, systems or apparatus4%
G08GTraffic control systems4%
H01BCables4%
PatentTitleYear
11,092,763Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture202111,016,255Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture202110,833,001Trace/via hybrid structure and method of manufacture202010,758,938Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor202010,727,176Trace/via hybrid structure and method of manufacture202010,613,283Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture202010,293,372Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor201910,295,354Preventive measures for a cognitive impaired user201910,290,572Trace/via hybrid structure and method of manufacture201910,274,440Method to facilitate investigation of chemical constituents in chemical analysis data201910,267,792Device for detecting toxic shock syndrome toxins and method of making the same201910,247,561Preventive measures for a cognitive impaired user201910,247,560Preventive measures for a cognitive impaired user201910,229,872Trace/via hybrid structure with thermally and electrically conductive support material for increased thermal and electrical performance201910,170,406Trace/via hybrid structure and method of manufacture201910,167,854Shape memory article with heat-generating microcapsule201910,136,563Active perforation for advanced server cooling201810,088,642Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture201810,080,951Simulating virtual topography using treadmills201810,056,324Trace/via hybrid structure with thermally and electrically conductive support material for increased thermal and electrical performance20189,995,590Preventive measures for a cognitive impaired user20189,973,231Protective structures to provide impact protection for portable devices20189,935,035Fluid cooled trace/via hybrid structure and method of manufacture20189,907,210'Active perforation for advanced server cooling'20189,875,958Trace/via hybrid structure and method of manufacture20189,869,983'Cooling system leak detection'20189,287,190'Devices employing semiconductor die having hydrophobic coatings, and related cooling methods'20169,220,183'Devices employing semiconductor die having hydrophobic coatings, and related cooling methods'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2021Patents assigned to IBM (28)· patent assignee history
2015–2021Based in Rochester, MN, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM282015–2021
Locations
LocationPatentsSpan
Rochester, Minnesota, US282015–2021