Inventor

Yoshihiro Kashiba

Inventor

Tokyo, JP

Overview

23→

Patents

1992–2016

Patent span

Electricity

Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%

G01RMeasuring electric variables31%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

C04BLime, magnesia5%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%

B08BCleaning in general3%

B23KSoldering or unsoldering3%

H01LSemiconductor devices3%

H02KDynamo-electric machines3%

H05KPrinted circuits3%

PatentTitleYear

9,236,316'Semiconductor device and method for manufacturing the same'2016 7,276,923'Semiconductor device test probe'2007 7,274,195'Semiconductor device test probe'2007 7,112,976'Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested'2006 6,989,681'Socket for testing a semiconductor device and a connecting sheet used for the same'2006 6,979,843'Power semiconductor device'2005 6,888,344'Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter'2005 6,885,204'Probe card, and testing apparatus having the same'2005 6,882,069'Vehicle AC generator with rectifier diode package disposed between cooling plates'2005 6,867,484'Semiconductor device'2005 6,794,890'Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested'2004 6,741,086'Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus'2004 6,667,626'Probe card, and testing apparatus having the same'2003 6,646,455'Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter'2003 6,633,176'Semiconductor device test probe having improved tip portion and manufacturing method thereof'2003 6,628,127'Probe card for testing semiconductor integrated circuit and method of manufacturing the same'2003 6,461,465'Apparatus for manufacturing liquid crystal panel and method thereof'2002 6,190,488'Apparatus for manufacturing liquid crystal panel and method thereof'2001 6,118,172'High-frequency circuit device and manufacturing method thereof'2000 5,637,917'Lead frame assembly for a semiconductor device'1997 5,609,287'Solder material, junctioning method, junction material, and semiconductor device'1997 5,251,803'Ceramic-metal composite substrate and method for producing the same'1993 5,153,077'Ceramic-metal composite substrate'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–2016Patents assigned to MITSUBISHI ELECTRIC CORP (21)· patent assignee history

1992–1997Based in Amagasaki, JP· patent location history

1997–2007Based in Tokyo, JP· patent location history

2000Based in Hyogo, JP· patent location history

2001–2002Patents assigned to ADVANCED DISPLAY KK (2)· patent assignee history

2003Patents assigned to MITSUBISHI DENKI KABSUHIKI KAI (1)· patent assignee history

2006Patents assigned to MISUBISHI DENKI KABUSHIKI KAIS (1)· patent assignee history

2016Based in Chiyoda-ku, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MITSUBISHI ELECTRIC CORP	21	1992–2016
ADVANCED DISPLAY KK	2	2001–2002
MISUBISHI DENKI KABUSHIKI KAIS	1	2006
MITSUBISHI DENKI KABSUHIKI KAI	1	2003

Locations

Location	Patents	Span
Tokyo, JP	18	1997–2007
Amagasaki, JP	3	1992–1997
Chiyoda-ku, JP	1	2016
Hyogo, JP	1	2000