Inventor
NIEN-FANG WU
Inventor
TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10DInorganic electric semiconductor devices7%
H01FMagnets4%
H01QAntennas, i.e. radio aerials4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
12,564,108Package structure and method of fabricating the same202612,557,661Package structure with antenna element202612,412,862Package structure and manufacturing method thereof202512,355,008Methods of fabricating package structure202512,288,752Semiconductor packages202512,243,681Programmable inductor and methods of manufacture202512,119,328Methods of fabricating the same die stack structure and semiconductor structure202412,057,439Integrated circuit packages202412,015,013Die stack structure, semiconductor structure and method of fabricating the same202411,810,897Package structure and method of fabricating the same202311,756,731Programmable inductor202311,742,297Semiconductor packages202311,705,411Chip package with antenna element202311,502,062Integrated circuit package and method202211,322,477Package structure and method of fabricating the same202211,264,362Semiconductor structure and method of fabricating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 16 | 2022–2026 |