Inventor
YUNHYEOK IM
Inventor
KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
G01KMeasuring temperature5%
G05DSystems for controlling or regulating non-electric variables5%
G06FElectric digital data processing5%
G06NComputing arrangements based on specific computational models5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use5%
PatentTitleYear
12,451,400Semiconductor package having improved heat dissipation characteristics202512,394,687Semiconductor package including a heat dissipation structure202512,123,789Method and device for temperature detection and thermal management based on power measurement202411,908,774Semiconductor package including composite molding structure202411,837,581Semiconductor package202311,502,061Semiconductor package202211,373,933Semiconductor package including composite molding structure202211,251,102Semiconductor module including heat dissipation layer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2022–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 8 | 2022–2025 |