Inventor

Kaoru Katayama

Inventor

Hadano, JP

Overview

26→

Patents

1986–2012

Patent span

Electricity

Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits21%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

Y10TTechnical subjects covered by former us classification17%

B23KSoldering or unsoldering9%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

Y02PClimate change mitigation technologies in the production or processing of goods4%

B41MPrinting, duplicating, marking, or copying processes3%

G01NInvestigating or analysing materials by determining their chemical or physical properties3%

G06FElectric digital data processing3%

B08BCleaning in general1%

PatentTitleYear

8,284,350'Lighting system and liquid crystal display using the same'2012 7,941,343'Method and system for enhancing product sales in network transactions'2011 7,401,393'Method for removing solder bumps from LSI'2008 7,329,855'Optical inspection of glass bottles using multiple cameras'2008 7,330,251'Method and apparatus for producing reference image in glass bottle inspecting apparatus'2008 6,795,105'Laser printing method and apparatus'2004 6,739,045'Method for removing solder bumps from LSI'2004 6,457,228'Method for sealing liquid coolant into module'2002 6,435,401'Apparatus and a method for removing solder from an object'2002 6,433,810'Laser printing method and apparatus for printing characters'2002 6,423,405'Surface reformation method of high polymer material'2002 6,410,881'Process for manufacturing electronic circuits'2002 6,325,270'Solder removing apparatus'2001 6,281,575'Multi-chip module'2001 6,269,998'Process for manufacturing electronic circuits'2001 6,161,748'Process for manufacturing electronic circuits'2000 6,133,135'Process for manufacturing electronic circuits'2000 6,017,424'Laser assisted surface reformation method of high polymer material'2000 5,940,728'Process for manufacturing electronic circuits'1999 5,832,595'Method of modifying conductive lines of an electronic circuit board and its apparatus'1998 5,801,350'Surface reformation method of high polymer material'1998 5,499,668'Process for making electronic device'1996 5,262,614'Circuit board and sealing structure and methods for manufacturing the same'1993 5,229,569'Laser machining apparatus and method of the same'1993 5,023,407'Printed circuit board with a uniform conductive layer formed by equalization of metals therein'1991 4,573,808'Pneumatic journal bearing'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1986–2008Based in Yokohama, JP· patent location history

1991–2012Patents assigned to HITACHI LTD (22)· patent assignee history

1991–2012Based in Hadano, JP· patent location history

2004Based in Tokyo, JP· patent location history

2008Patents assigned to KIRIN TECHNO SYSTEM CORP (2)· patent assignee history

2011Based in Tustin, CA, US· patent location history

2012Patents assigned to ABE MAKOTO (1)· patent assignee history

2012Patents assigned to KATAYAMA KAORU (1)· patent assignee history

2012Patents assigned to KONNO AKITOYO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	22	1991–2012
KIRIN TECHNO SYSTEM CORP	2	2008
ABE MAKOTO	1	2012
KATAYAMA KAORUself	1	2012
KONNO AKITOYO	1	2012

Locations

Location	Patents	Span
Hadano, JP	21	1991–2012
Yokohama, JP	3	1986–2008
Tustin, California, US	1	2011
Tokyo, JP	1	2004