Inventor
Hideshi Tomita
Inventor
Tokyo, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Lprimary
C08LCompositions of macromolecular compounds20%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds17%
C09JAdhesives12%
H05KPrinted circuits10%
Y10TTechnical subjects covered by former us classification10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
C08JWorking-up3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
C09KMaterials for miscellaneous applications, not provided for elsewhere3%
PatentTitleYear
10,997,961Acoustic lens and production method thereof, and acoustic wave probe20217,253,246'Thermosetting polycarbodiimide copolymer'20076,979,703'Acoustically matching layer and composition thereof'20056,818,097'Highly heat-resistant plasma etching electrode and dry etching device including the same'20046,524,711'Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition'20036,486,266'Thermosetting resin composition'20026,485,833'Resin-coated metal foil'20026,440,258'Adhesive film for semiconductor package'20026,387,505'Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board'20026,333,101'Method of adhering adherends'20016,331,226'LCP bonding method'20016,310,119'Film-shaped encapsulating agent for electronic parts'20016,300,425'Thermosetting resin composition'20016,225,417'One-pack type epoxy resin composition'20016,172,143'Resin composition for use in sealant and liquid sealant using the resin composition'20016,140,454'Adhesive resin composition and sealing resin composition'20006,103,836'Epoxy resin composition'20005,679,730'Epoxy resin composition and epoxy resin-based adhesive'19975,650,476'Process for production of polycarbodiimide resin powder'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2007Patents assigned to NISSHIN SPINNING (18)· patent assignee history
1997–2007Based in Tokyo, JP· patent location history
2001–2021Based in Chiba, JP· patent location history
2021Patents assigned to JAPAN RADIO UEDA CO LTD (1)· patent assignee history
2021Patents assigned to NISSHINBO HOLDINGS INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NISSHIN SPINNING | 18 | 1997–2007 |
| JAPAN RADIO UEDA CO LTD | 1 | 2021 |
| NISSHINBO HOLDINGS INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 13 | 1997–2007 |
| Chiba, JP | 6 | 2001–2021 |