Inventor
Paul Lefevre
Inventor
Topsfield, MA, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing41%
B24DTools for grinding, buffing or sharpening25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
B29CShaping or joining of plastics2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C08JWorking-up2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
D04HMaking textile fabrics, e.g. from fibres or filamentary material2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,946,495Low density polishing pad202110,293,459Polishing pad having polishing surface with continuous protrusions201910,160,092Polishing pad having polishing surface with continuous protrusions having tapered sidewalls20189,931,729Polishing pad with grooved foundation layer and polishing surface layer20189,931,728Polishing pad with foundation layer and polishing surface layer20189,868,185'Polishing pad with foundation layer and window attached thereto'20189,796,063'Multi-layered chemical-mechanical planarization pad'20179,649,742'Polishing pad having polishing surface with continuous protrusions'20179,597,769'Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer'20179,238,294'Polishing pad having porogens with liquid filler'20169,162,341'Chemical-mechanical planarization pad including patterned structural domains'20159,067,297'Polishing pad with foundation layer and polishing surface layer'20159,067,298'Polishing pad with grooved foundation layer and polishing surface layer'20158,790,165'Multi-layered chemical-mechanical planarization pad'20148,758,659'Method of grooving a chemical-mechanical planarization pad'20148,684,794'Chemical mechanical planarization pad with void network'20148,546,260'Fabric containing non-crimped fibers and methods of manufacture'20138,491,360'Three-dimensional network in CMP pad'20138,435,099'Chemical-mechanical planarization pad including patterned structural domains'20138,430,721'Chemical-mechanical planarization pad'20138,377,351'Polishing pad with controlled void formation'20138,172,648'Chemical-mechanical planarization pad'20127,985,121'Chemical-mechanical planarization pad having end point detection window'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2015Patents assigned to INNOPAD INC (8)· patent assignee history
2011–2017Based in Topsfield, MA, US· patent location history
2012–2014Patents assigned to HSU OSCAR K (9)· patent assignee history
2012–2014Patents assigned to LEFEVRE PAUL (9)· patent assignee history
2012–2014Patents assigned to WELLS DAVID ADAM (8)· patent assignee history
2015–2021Patents assigned to NEXPLANAR CORP (10)· patent assignee history
2015–2021Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEXPLANAR CORP | 10 | 2015–2021 |
| HSU OSCAR K | 9 | 2012–2014 |
| LEFEVRE PAULself | 9 | 2012–2014 |
| INNOPAD INC | 8 | 2011–2015 |
| WELLS DAVID ADAM | 8 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Topsfield, Massachusetts, US | 12 | 2011–2017 |
| Portland, OR, US | 11 | 2015–2021 |