Inventor

Krishna G. Sachdev

Inventor

Hopewell Junction, NY, US

Overview

1981–2011

Patent span

Electricity

Primary field (CPC H)

Patents· 75 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits14%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%

Y10TTechnical subjects covered by former us classification10%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%

C11DDetergent compositions5%

B41MPrinting, duplicating, marking, or copying processes4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%

C04BLime, magnesia3%

PatentTitleYear

7,964,542'Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly'2011 7,608,295'Polyimide compositions and use thereof in ceramic product defect repair'2009 7,405,247'Conductive adhesive composition'2008 7,393,419'Conductive adhesive rework method'2008 7,329,439'UV-curable solvent free compositions and use thereof in ceramic chip defect repair'2008 7,312,261'Thermal interface adhesive and rework'2007 6,800,141'Semi-aqueous solvent based method of cleaning rosin flux residue'2004 6,742,530'Semi-aqueous solvent cleaning of paste processing residue from substrates'2004 6,682,872'UV-curable compositions and method of use thereof in microelectronics'2004 6,652,665'Method of removing silicone polymer deposits from electronic components'2003 6,635,118'Aqueous cleaning of polymer apply equipment'2003 6,597,058'Method of forming defect-free ceramic structures using thermally depolymerizable surface layer'2003 6,569,252'Semi-aqueous solvent cleaning of paste processing residue from substrates'2003 6,548,175'Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof'2003 6,528,145'Polymer and ceramic composite electronic substrates'2003 6,525,009'Polycarboxylates-based aqueous compositions for cleaning of screening apparatus'2003 6,515,061'Polyester dispersants for high thermal conductivity paste'2003 6,503,874'Cleaning method to remove flux residue in electronic assembly'2003 6,426,007'Removal of soluble metals in waste water from aqueous cleaning and etching processes'2002 6,406,778'Multi-thickness, multi-layer green sheet lamination and method thereof'2002 6,351,871'Aqueous quaternary ammonium hydroxide as a screening mask cleaner'2002 6,280,527'Aqueous quaternary ammonium hydroxide as a screening mask cleaner'2001 6,277,799'Aqueous cleaning of paste residue'2001 6,262,390'Repair process for aluminum nitride substrates'2001 6,261,927'Method of forming defect-free ceramic structures using thermally depolymerizable surface layer'2001 6,245,171'Multi-thickness, multi-layer green sheet lamination and method thereof'2001 6,228,511'Structure and process for thin film interconnect'2001 6,221,269'Method of etching molybdenum metal from substrates'2001 6,165,629'Structure for thin film interconnect'2000 6,114,450'Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin'2000 6,032,683'System for cleaning residual paste from a mask'2000 5,976,710'Low TCE polyimides as improved insulator in multilayer interconnect structures'1999 5,955,543'Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin'1999 5,938,856'Process of removing flux residue from microelectronic components'1999 5,916,374'Optimized in-line mask cleaning system'1999 5,888,308'Process for removing residue from screening masks with alkaline solution'1999 5,773,561'Polymer sealants/adhesives and use thereof in electronic package assembly'1998 5,700,581'Solvent-free epoxy based adhesives for semiconductor chip attachment and process'1997 5,643,818'Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip'1997 5,591,789'Polyester dispersants for high thermal conductivity paste'1997 5,532,608'Ceramic probe card and method for reducing leakage current'1996 5,470,693'Method of forming patterned polyimide films'1995 5,422,223'Silicon-containing positive resist and use in multilayer metal structures'1995 5,399,462'Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane'1995 5,374,503'Method of forming patterned polyimide films'1994 5,310,863'Polyimide materials with improved physico-chemical properties'1994 5,303,862'Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures'1994 5,231,751'Process for thin film interconnect'1993 5,114,826'Photosensitive polyimide compositions'1992 5,115,090'Viscosity stable, essentially gel-free polyamic acid compositions'1992 4,894,279'Electroerosion print media having protective coatings modified with organotitanium reagents'1990 4,830,909'Scratch resistant recording materials for electroerosion printing comprising cross-linked polymer base layer'1989 4,826,564'Method of selective reactive ion etching of substrates'1989 4,772,346'Method of bonding inorganic particulate material'1988 4,692,205'Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings'1987 4,678,701'Resistive printing ribbon having improved properties'1987 4,665,006'Positive resist system having high resistance to oxygen reactive ion etching'1987 4,617,579'Hydrophilic protective coatings for electroerosion printing'1986 4,599,243'Use of plasma polymerized organosilicon films in fabrication of lift-off masks'1986 4,596,733'Electroerosion recording material with polyorganosiloxane overlayer'1986 4,567,490'Electroerosion recording medium of improved lubricity'1986 4,562,091'Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks'1985 4,554,562'Scratch resistant recording materials for electroerosion printing not requiring a lubricant overcoat'1985 4,549,824'Ink additives for efficient thermal ink transfer printing processes'1985 4,550,061'Electroerosion printing media using depolymerizable polymer coatings'1985 4,525,722'Chemical heat amplification in thermal transfer printing'1985 4,519,872'Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes'1985 4,493,855'Use of plasma polymerized organosilicon films in fabrication of lift-off masks'1985 4,353,976'Novel silver complexing agents'1982 4,311,638'Silver complexing agents'1982 4,278,814'Preparation of 2-methylene-1,3-propanediamide by a fluoride anion-initiated .beta.-elimination reaction'1981 4,272,632'Novel silver complexing agents'1981 4,267,256'Novel silver complexing agents'1981 4,267,254'Photographic process'1981 4,251,617'Novel silver complexing agents'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1981–1982Patents assigned to POLAROID CORP (7)· patent assignee history

1981–1982Based in Beacon, NY, US· patent location history

1981Based in Cambridge, MA, US· patent location history

1985–2011Patents assigned to IBM (67)· patent assignee history

1985–1992Based in Wappingers Falls, NY, US· patent location history

1992Patents assigned to HUMMEL JOHN P (1)· patent assignee history

1992Patents assigned to KWONG RANEE W (1)· patent assignee history

1992Patents assigned to LANG ROBERT N (1)· patent assignee history

1993–2011Based in Hopewell Junction, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	67	1985–2011
POLAROID CORP	7	1981–1982
HUMMEL JOHN P	1	1992
KWONG RANEE W	1	1992
LANG ROBERT N	1	1992

Locations

Location	Patents	Span
Hopewell Junction, New York, US	48	1993–2011
Wappingers Falls, New York, US	20	1985–1992
Beacon, New York, US	4	1981–1982
Cambridge, Massachusetts, US	3	1981