Inventor
Sung-Hyup Kim
Inventor
Hwaseong-si, KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B05CApparatus for applying fluent materials to surfaces, in general6%
G01RMeasuring electric variables6%
G03GElectrography6%
G05BControl or regulating systems in general6%
H01JElectric discharge tubes or discharge lamps6%
H10DInorganic electric semiconductor devices6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
PatentTitleYear
10,811,381Wafer to wafer bonding method and wafer to wafer bonding system202010,811,287Spin coater and substrate treating apparatus having the same202010,763,243Substrate bonding apparatus202010,295,564Apparatus for clamping a probe card and probe card including the same20199,791,855'Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor'20177,792,453'Image forming apparatus with opening/closing member'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2010–2017Based in Suwon-si, KR· patent location history
2019–2020Based in Hwaseong-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2010–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hwaseong-si, KR | 4 | 2019–2020 |
| Suwon-si, KR | 2 | 2010–2017 |