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Inventor

Wei Huang

Inventor
Palo Alto, CA, US

Overview

2→
Patents
1996–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
B29LIndexing scheme associated with subclass b29c, relating to particular articles17%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering17%
G01NInvestigating or analysing materials by determining their chemical or physical properties17%
H03HImpedance networks, e.g. resonant circuits17%
PatentTitleYear
10,967,5593D printed object with embedded sensing device20215,578,974'Piezoelectric filter with a curved electrode'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996Patents assigned to MOTOROLA INC (1)· patent assignee history
1996Based in Taiwan, TW· patent location history
2021Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (1)· patent assignee history
2021Based in Palo Alto, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO12021
MOTOROLA INC11996
Locations
LocationPatentsSpan
Palo Alto, California, US12021
Taiwan, TW11996