LexDanaLexDanabeta
Inventor

Tatsushi Yoshida

Inventor
Chigasaki, JP

Overview

33→
Patents
1993–2018
Patent span
Physics
Primary field (CPC G)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Bprimary
G11BInformation storage based on relative movement between record carrier and transducer32%
Y10TTechnical subjects covered by former us classification14%
B23KSoldering or unsoldering13%
H05KPrinted circuits12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
Y02PClimate change mitigation technologies in the production or processing of goods6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool1%
B29CShaping or joining of plastics1%
B29DProducing particular articles from plastics or from substances in a plastic state1%
PatentTitleYear
10,029,327Solder ball jet nozzle having improved reliability20188,881,967'Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly'20148,477,457'Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge'20137,619,856'Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension'20097,583,475'Rotating disk storage device and integrated wire head suspension assembly'20097,550,695'Method for manufacturing a magnetic disk device with improved head gimbal assembly'20097,486,480'Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass'20097,400,470'Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energy'20087,380,329'Method of assembling a head gimbal assembly'20087,342,749'Method of removing lead-free solder from slider pad and magnetic disk drive'20087,210,221'Transfer system for assembling a head gimbal assembly'20077,161,766'Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly'20076,982,294'Flame retardant and flame-retardant resin composition'20066,848,167'Apparatus and method for separating head gimbal assembly from bonding jig'20056,823,581'Apparatus for assembling a head gimbal assembly'20046,742,694'Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus'20046,676,005'Wire bonding method and apparatus'20046,676,778'Method for bonding slider and suspension together and deciding conditions of laser beam irradiation'20046,628,380'Appearance inspecting jig for small parts and inspecting method employing the same jig'20036,556,384'Head supporting arm, Data recording apparatus, with laser beam exposing aperture and limiter'20036,553,647'Method of wiring a head suspension assembly'20036,543,677'Solder-ball bonding device and method'20036,493,189'Apparatus and method for configuring and electrically interconnecting the elements of a head gimbal assembly in a disk drive'20026,471,251'Spirally corrugated pipe elbow and method for manufacturing same'20026,459,549'Hard disk drive with slider support structure and head gimbal assembly'20026,382,499'Ultrasonic bonding performing method and method for transforming, retaining and releasing a suspension assembly'20026,366,431'Head supporting arm having laser beam exposing aperture'20026,355,122'Method for ultrasonically connecting and inspecting slider-lead joints for disk drive head gimbal assemblies'20026,336,581'Solder ball connection device and capillary tube thereof'20026,321,974'Method for ultrasonic bonding of slider and lead in a hard disk drive head gimbal assembly'20016,052,259'Head support arm having conductive wires of a disk drive device'20005,754,370'Wired suspension assembly in disk storage device method for assembly head suspension assembly'19985,258,483'Polyarylate and process for preparing the same'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2005Patents assigned to IBM (15)· patent assignee history
1998–2009Based in Chigasaki, JP· patent location history
2002Based in Osaka, JP· patent location history
2003–2014Based in Kanagawa, JP· patent location history
2004–2009Patents assigned to HITACHI GLOBAL STORAGE TECH (12)· patent assignee history
2006Based in Hyogo, JP· patent location history
2013–2018Patents assigned to HGST Netherlands BV (3)· patent assignee history
2013–2014Patents assigned to MATSUMOTO YUHSUKE (2)· patent assignee history
2013–2014Patents assigned to OOSAWA EIKI (2)· patent assignee history
2018Based in Fujisawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM151998–2005
HITACHI GLOBAL STORAGE TECH122004–2009
HGST Netherlands BV32013–2018
MATSUMOTO YUHSUKE22013–2014
OOSAWA EIKI22013–2014
Locations
LocationPatentsSpan
Chigasaki, JP211998–2009
Kanagawa, JP82003–2014
Fujisawa, JP12018
Hyogo, JP12006
Osaka, JP12002