Inventor

Ryuji Nomoto

Inventor

Kawasaki, JP

Overview

1997–2015

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%

H05KPrinted circuits14%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

H10DInorganic electric semiconductor devices13%

Y02PClimate change mitigation technologies in the production or processing of goods11%

B23KSoldering or unsoldering4%

Y10TTechnical subjects covered by former us classification4%

B29CShaping or joining of plastics2%

G06FElectric digital data processing2%

H01LSemiconductor devices2%

PatentTitleYear

9,041,186'Encapsulated semiconductor chips with wiring including controlling chip and method of making the same'2015 7,863,745'Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device'2011 7,456,089'Semiconductor device and method of manufacturing the semiconductor device'2008 7,251,801'Method of designing circuit board'2007 7,144,754'Device having resin package and method of producing the same'2006 7,122,897'Semiconductor device and method of manufacturing the semiconductor device'2006 6,856,017'Device having resin package and method of producing the same'2005 6,573,121'Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame'2003 6,495,773'Wire bonded device with ball-shaped bonds'2002 6,476,503'Semiconductor device having columnar electrode and method of manufacturing same'2002 6,376,921'Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame'2002 6,329,711'Semiconductor device and mounting structure'2001 6,288,444'Semiconductor device and method of producing the same'2001 6,255,740'Semiconductor device having a lead portion with outer connecting terminals'2001 6,215,182'Semiconductor device and method for producing the same'2001 6,207,477'Semiconductor device having a ball grid array and a fabrication process thereof'2001 6,072,239'Device having resin package with projections'2000 5,930,603'Method for producing a semiconductor device'1999 5,842,628'Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method'1998 5,656,550'Method of producing a semicondutor device having a lead portion with outer connecting terminal'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2008Patents assigned to FUJITSU LTD (18)· patent assignee history

1997–2015Based in Kawasaki, JP· patent location history

2011–2015Patents assigned to FUJITSU SEMICONDUCTOR LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FUJITSU LTD	18	1997–2008
FUJITSU SEMICONDUCTOR LTD	2	2011–2015

Locations

Location	Patents	Span
Kawasaki, JP	20	1997–2015