Inventor
Junji Fujino
Inventor
Tokyo, JP
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices22%
H03FAmplifiers5%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light4%
G06FElectric digital data processing4%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light4%
H05KPrinted circuits4%
H03KPulse technique2%
H03MCoding2%
H04WWireless communication networks2%
PatentTitleYear
11,004,761Packaging of a semiconductor device with dual sealing materials202110,978,366Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module202110,727,163Semiconductor device202010,658,284Shaped lead terminals for packaging a semiconductor device for electric power202010,559,538Power module202010,431,528Semiconductor device201910,204,886Semiconductor device201910,096,570Manufacturing method for power semiconductor device, and power semiconductor device20189,917,064'Semiconductor device with a plate-shaped lead terminal'20189,899,345'Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power'20189,818,716'Power module'20179,698,091'Power semiconductor device'20179,691,730'Semiconductor device and method for manufacturing the same'20179,632,543'Mobile device'20179,455,215'Semiconductor device and method for manufacturing the same'20169,443,778'Semiconductor device and manufacturing method thereof'20169,433,075'Electric power semiconductor device'20169,236,316'Semiconductor device and method for manufacturing the same'20169,142,493'Semiconductor device'20159,029,771'Semiconductor device and electronic apparatus employing the same'20158,675,008'Calculation device, movement detection device, and electronic instrument'20148,513,892'Illuminance sensor, and electronic equipment and semiconductor device using the same'20138,159,835'Laser apparatus'20128,003,930'Ambient light sensor'20117,875,901'Optical device package and optical semiconductor device using the same'20117,838,811'Ambient light sensor'20107,679,181'Semiconductor device'20107,626,275'Semiconductor device'20097,622,750'Optical device package and optical semiconductor device using the same'20097,554,480'Analog/digital converter, illuminance sensor, illumination device, and electronic device'20097,509,059'Optical receiver and data communication apparatus comprising same'20096,781,108'Noise canceling photosensor-amplifier device'20045,950,908'Solder supplying method, solder supplying apparatus and soldering method'19995,443,659'Flux for soldering and solder composition comprising the same and soldering method using the same'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2021Patents assigned to MITSUBISHI ELECTRIC CORP (25)· patent assignee history
1995Based in Amagasaki, JP· patent location history
1999–2021Based in Tokyo, JP· patent location history
2004–2017Patents assigned to ROHM CO LTD (9)· patent assignee history
2004–2017Based in Kyoto, JP· patent location history
2012–2015Patents assigned to FUJINO JUNJI (5)· patent assignee history
2013–2015Patents assigned to NAKATA YUICHIRO (3)· patent assignee history
2013–2015Patents assigned to UEDAIRA YOSHITSUGU (3)· patent assignee history
2015–2016Based in Chiyoda-ku, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 25 | 1995–2021 |
| ROHM CO LTD | 9 | 2004–2017 |
| FUJINO JUNJIself | 5 | 2012–2015 |
| NAKATA YUICHIRO | 3 | 2013–2015 |
| UEDAIRA YOSHITSUGU | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 21 | 1999–2021 |
| Kyoto, JP | 9 | 2004–2017 |
| Chiyoda-ku, JP | 3 | 2015–2016 |
| Amagasaki, JP | 1 | 1995 |