Inventor
YunSeok Choi
Inventor
Hwaseong-si, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices13%
H04LTransmission of digital information, e.g. telegraphic communication13%
H04WWireless communication networks13%
H10DInorganic electric semiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
10,869,308Apparatus and method for allocating resources in wireless communication system20208,928,132'Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package'20158,823,185'Semiconductor packages'20148,330,278'Semiconductor package including a plurality of stacked semiconductor devices'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2012–2015Patents assigned to CHOI YUNSEOK (3)· patent assignee history
2012Patents assigned to KIM YONGHOON (1)· patent assignee history
2012–2014Based in Hwaseong-si, KR· patent location history
2014Patents assigned to CHUNG YECHUNG (1)· patent assignee history
2014Patents assigned to KIM WOOJAE (1)· patent assignee history
2015Based in Yongin-si, KR· patent location history
2020Based in Suwon-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 4 | 2012–2020 |
| CHOI YUNSEOKself | 3 | 2012–2015 |
| CHUNG YECHUNG | 1 | 2014 |
| KIM WOOJAE | 1 | 2014 |
| KIM YONGHOON | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hwaseong-si, KR | 2 | 2012–2014 |
| Suwon-si, KR | 1 | 2020 |
| Yongin-si, KR | 1 | 2015 |