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Inventor

Seiji Shika

Inventor
Tokyo, JP

Overview

2→
Patents
2007–2016
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds17%
C08LCompositions of macromolecular compounds17%
H05KPrinted circuits17%
Y10TTechnical subjects covered by former us classification17%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
C08JWorking-up8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
PatentTitleYear
9,351,397'Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same'20167,192,651'Resin composition and prepreg for laminate and metal-clad laminate'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2016Patents assigned to MITSUBISHI GAS CHEMICAL CO (2)· patent assignee history
2007–2016Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI GAS CHEMICAL CO22007–2016
Locations
LocationPatentsSpan
Tokyo, JP22007–2016