Inventor
Tsuyoshi Ishizaka
Inventor
Ibaraki, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
C09JAdhesives17%
H01LSemiconductor devices17%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C08LCompositions of macromolecular compounds11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
PatentTitleYear
10,301,509Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape201910,128,131Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device20189,659,883'Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package'20177,268,191'Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2019Patents assigned to NITTO DENKO CORP (4)· patent assignee history
2007–2019Based in Ibaraki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 4 | 2007–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 4 | 2007–2019 |