Inventor
Takeshi Tamura
Inventor
Anan-shi, JP
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10HInorganic light-emitting semiconductor devices having potential barriers10%
F21VFunctional features or details of lighting devices or systems thereof7%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted7%
Y10TTechnical subjects covered by former us classification7%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
11,047,551Light emitting device202111,015,768Method of manufacturing light source device202110,670,233Light emitting device202010,527,257Light emitting device202010,340,248Bonding systems201910,274,168Light emitting device201910,071,544Separation apparatus, separation system, and separation method20189,784,438'Connected body of a plurality of light emitting devices'20179,708,702'Wiping device and hot dip coating apparatus using the same'20179,679,798'Substrate conveyance apparatus and substrate peeling system'20179,595,462'Peeling system'20179,385,283'Light emitting device equipped with protective member'20169,343,349'Substrate holding apparatus and substrate holding method'20169,097,681'Inspection device, bonding system and inspection method'20158,933,621'Light emitting device'20158,795,463'Joint system, joint method, program and computer storage medium'20147,867,926'Substrate processing apparatus and method'20117,633,180'Electronic apparatus and starting method of the electronic apparatus'20096,642,618'Light-emitting device and production thereof'20036,524,389'Substrate processing apparatus'20036,354,832'Substrate processing apparatus and substrate processing method'20025,541,683'Instant film pack and instant camera'19965,295,853'Mechanism for removably mounting dut board on test head'19944,564,252'Electrical connector assembly'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994Patents assigned to HEWLETT PACKARD CO (1)· patent assignee history
1994–2017Based in Tokyo, JP· patent location history
1996Patents assigned to FUJI PHOTO FILM CO LTD (1)· patent assignee history
2002–2019Patents assigned to TOKYO ELECTRON LTD (10)· patent assignee history
2011–2018Based in Koshi, JP· patent location history
2015–2021Patents assigned to NICHIA CORP (8)· patent assignee history
2015–2021Based in Anan-shi, JP· patent location history
2017–2018Patents assigned to INTEL CORP (2)· patent assignee history
2017–2019Based in Kumamoto, JP· patent location history
2020–2021Based in Tokushima, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 10 | 2002–2019 |
| NICHIA CORP | 8 | 2015–2021 |
| INTEL CORP | 2 | 2017–2018 |
| FUJI PHOTO FILM CO LTD | 1 | 1996 |
| HEWLETT PACKARD CO | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Anan-shi, JP | 6 | 2015–2021 |
| Koshi, JP | 5 | 2011–2018 |
| Kumamoto, JP | 3 | 2017–2019 |
| Tokyo, JP | 3 | 1994–2017 |
| Tokushima, JP | 2 | 2020–2021 |