Inventor
CHIH-HSIN KO
Inventor
TW
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices30%
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
G06FElectric digital data processing3%
B82YSpecific uses or applications of nanostructures2%
PatentTitleYear
12,477,765FinFET device having a channel defined in a diamond-like shape semiconductor structure202512,469,710Method of manufacturing a semiconductor device202512,356,674Method for fabricating a strained structure and structure formed202512,321,680Integrated circuit fin structure202512,191,401Manufacturing method for semiconductor structure having a plurality of fins202512,183,802Method of manufacturing semiconductor devices and semiconductor devices202412,170,314Semiconductor device and manufacturing method thereof202411,972,982Method of manufacturing a semiconductor device202411,916,151Semiconductor structure having fin with all around gate202411,916,107Semiconductor device and manufacturing method thereof202411,908,749Method of metal gate formation and structures formed by the same202411,861,282Integrated circuit fin structure manufacturing method202411,854,898Wrap-around contact on FinFET202311,855,210Method for fabricating a strained structure and structure formed202311,664,456Semiconductor structures and methods of forming thereof202311,568,122Integrated circuit fin layout method202311,557,650Semiconductor device and manufacturing method thereof202311,508,627Method of metal gate formation and structures formed by the same202211,502,186FinFET device having a channel defined in a diamond-like shape semiconductor structure202211,437,517Semiconductor structures and methods with high mobility and high energy bandgap materials202211,404,322Method of manufacturing a semiconductor device202211,393,713Semiconductor device and manufacturing method therefore202211,362,000Wrap-around contact on FinFET202211,251,303Method for fabricating a strained structure and structure formed202211,177,368Semiconductor arrangement202111,158,739Semiconductor structure having field plate and associated fabricating method2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (26)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 26 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 26 | 2021–2025 |