Inventor
Jon McChesney
Inventor
Fremont, CA, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H01JElectric discharge tubes or discharge lamps27%
H01LSemiconductor devices21%
C23CCoating metallic material5%
B25JManipulators3%
F24FAir-conditioning3%
G01MTesting static or dynamic balance of machines or structures3%
H02NElectric machines not otherwise provided for3%
H03HImpedance networks, e.g. resonant circuits3%
G06TImage data processing or generation, in general2%
PatentTitleYear
11,011,353Systems and methods for performing edge ring characterization202110,957,521Image based plasma sheath profile detection on plasma processing tools202110,825,661Systems for cooling RF heated chamber components202010,770,339Automated replacement of consumable parts using interfacing chambers202010,690,374Air cooled faraday shield and methods for using the same202010,658,222Moveable edge coupling ring for edge process control during semiconductor wafer processing202010,651,013Systems and methods for tuning to reduce reflected power in multiple states202010,600,620Temperature control in RF chamber with heater and air amplifier202010,541,168Edge ring centering method using ring dynamic alignment data202010,427,307Automated replacement of consumable parts using end effectors interfacing with plasma processing system201910,410,836Systems and methods for tuning to reduce reflected power in multiple states201910,304,717Automated replacement of consumable parts using interfacing chambers201910,242,844Rotating RF electric field antenna for uniform plasma generation201910,124,492Automated replacement of consumable parts using end effectors interfacing with plasma processing system201810,062,599Automated replacement of consumable parts using interfacing chambers20189,978,565Systems for cooling RF heated chamber components20189,885,493'Air cooled faraday shield and methods for using the same'20189,679,751'Chamber filler kit for plasma etch chamber useful for fast gas switching'20179,530,656'Temperature control in RF chamber with heater and air amplifier'20169,082,805'System and method for testing an electrostatic chuck'20158,522,716'Protective coating for a plasma processing chamber part and a method of use'20138,143,904'System and method for testing an electrostatic chuck'20126,962,644'Tandem etch chamber plasma processing system'20056,727,655'Method and apparatus to monitor electrical states at a workpiece in a semiconductor processing chamber'20046,494,958'Plasma chamber support with coupled electrode'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2005Patents assigned to APPLIED MATERIALS INC (2)· patent assignee history
2002–2005Based in San Ramon, CA, US· patent location history
2012–2021Patents assigned to LAM RES CORP (22)· patent assignee history
2012–2018Patents assigned to MCCHESNEY JON (5)· patent assignee history
2012–2015Patents assigned to FANG YAN (2)· patent assignee history
2012–2015Patents assigned to HUANG TUOCHUAN (2)· patent assignee history
2012–2015Based in Santa Clara, CA, US· patent location history
2016–2020Based in Sacramento, CA, US· patent location history
2018–2021Based in Fremont, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 22 | 2012–2021 |
| MCCHESNEY JONself | 5 | 2012–2018 |
| APPLIED MATERIALS INC | 2 | 2002–2005 |
| FANG YAN | 2 | 2012–2015 |
| HUANG TUOCHUAN | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 13 | 2018–2021 |
| Sacramento, California, US | 6 | 2016–2020 |
| Santa Clara, California, US | 3 | 2012–2015 |
| San Ramon, California, US | 3 | 2002–2005 |