Inventor
Naoki Komai
Inventor
Kanagawa, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
B24BMachines, devices, or processes for grinding or polishing10%
C25FProcesses for the electrolytic removal of materials from objects7%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool5%
B41JTypewriters3%
C23FNon-mechanical removal of metallic material from surface3%
H01LSemiconductor devices3%
H05KPrinted circuits3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
10,986,281Pinhole camera, electronic apparatus and manufacturing method202110,195,872Label printer201910,052,884Label issuing apparatus20189,379,006'Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus'20168,664,763'Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus'20148,034,704'Method for manufacturing semiconductor device and semiconductor device'20117,851,236'Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuit'20107,186,322'Methods of producing and polishing semiconductor device and polishing apparatus'20077,141,501'Polishing method, polishing apparatus, and method of manufacturing semiconductor device'20067,033,943'Etching solution, etching method and method for manufacturing semiconductor device'20066,878,632'Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof'20056,846,227'Electro-chemical machining appartus'20056,809,029'Semiconductor production device and production method for semiconductor device'20046,797,623'Methods of producing and polishing semiconductor device and polishing apparatus'20046,777,321'Method of forming buried wiring'20046,736,699'Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing'20046,709,979'Method of manufacturing a semiconductor device'20046,602,787'Method for fabricating semiconductor devices'20036,534,117'Electroless plating method and electroless plating solution'20036,524,429'Method of forming buried wiring, and apparatus for processing substratum'20036,479,384'Process for fabricating a semiconductor device'20026,465,342'Semiconductor device and its manufacturing method'20026,380,065'Interconnection structure and fabrication process therefor'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2021Patents assigned to SONY CORP (21)· patent assignee history
2002–2021Based in Kanagawa, JP· patent location history
2003–2004Patents assigned to KOBE STEEL LTD (2)· patent assignee history
2014Patents assigned to KAGAWA YOSHIHISA (1)· patent assignee history
2014Patents assigned to KOMAI NAOKI (1)· patent assignee history
2018–2019Patents assigned to ISHIDA SEISAKUSHO (2)· patent assignee history
2018–2019Based in Ritto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 21 | 2002–2021 |
| ISHIDA SEISAKUSHO | 2 | 2018–2019 |
| KOBE STEEL LTD | 2 | 2003–2004 |
| KAGAWA YOSHIHISA | 1 | 2014 |
| KOMAI NAOKIself | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 21 | 2002–2021 |
| Ritto, JP | 2 | 2018–2019 |