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Inventor

WENMIN HSU

Inventor
TW

Overview

2→
Patents
2025–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary
G01RMeasuring electric variables25%
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
12,532,720Forming openings through carrier substrate of IC package assembly for fault identification202612,219,709Forming trench in IC chip through multiple trench formation and deposition processes2025

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2025–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2025–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22025–2026
Locations
LocationPatentsSpan
TW22025–2026