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Inventor

David O'Sullivan

Inventor
Sinzing, DE

Overview

4→
Patents
2014–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
PatentTitleYear
9,646,856'Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip'20179,111,947'Chip arrangement with a recessed chip housing region and a method for manufacturing the same'20159,064,883'Chip with encapsulated sides and exposed surface'20158,786,105'Semiconductor device with chip having low-k-layers'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2017Patents assigned to INTEL MOBILE COMM GMBH (4)· patent assignee history
2014–2015Patents assigned to MEYER THORSTEN (2)· patent assignee history
2014–2015Patents assigned to O'SULLIVAN DAVID (2)· patent assignee history
2014Patents assigned to ALBERS SVEN (1)· patent assignee history
2014–2017Based in Sinzing, DE· patent location history
2015–2017Patents assigned to INTEL DEUTSCHLAND GMBH (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL MOBILE COMM GMBH42014–2017
INTEL DEUTSCHLAND GMBH22015–2017
MEYER THORSTEN22014–2015
O'SULLIVAN DAVIDself22014–2015
ALBERS SVEN12014
Locations
LocationPatentsSpan
Sinzing, DE42014–2017