Inventor
YEN-CHUN LIN
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10DInorganic electric semiconductor devices18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
B82YSpecific uses or applications of nanostructures7%
G06FElectric digital data processing4%
PatentTitleYear
12,557,629Interconnect structure and methods of forming the same202612,165,975Method of forming interconnect structure having a barrier layer202412,094,770Ruthenium-based liner for a copper interconnect202411,810,827FinFET device with different liners for PFET and NFET and method of fabricating thereof202311,742,290Interconnect structure and method of forming thereof202311,688,654Test line structure, semiconductor structure and method for forming test line structure202311,508,631Semiconductor device202211,264,505FinFET device and method of forming same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2026 |